公开(公告)号：US5808530A

公开(公告)日：1998-09-15

申请号：US610166

申请日：1996-02-29

Applicant: Ndiata Kalonji ,  Jack Semo ,  Jacques Tanniou

Inventor： Ndiata Kalonji ,  Jack Semo ,  Jacques Tanniou

IPC: H01L33/62 ,  H01S5/022 ,  H01S5/042 ,  H01S5/062 ,  H01P5/00 ,  H05K5/02

CPC classification number: H01L33/62 ,  H01L2924/0002

Abstract: The invention relates to a modular assembly comprising at least two modules to be assembled together and to be electrically interconnected when assembled for the purpose of conveying a microwave signal from an electronic circuit of one of the modules to an electronic circuit of the other module, said electronic circuits being disposed in respective packages. One of said electronic circuits includes at least one opto-electronic component that is optically connected to at least one optical fiber. Both packages are adapted to receive a microwave feedthrough having a central conductor whose axial ends come into contact with conductive tracks belonging to each of said electronic circuits, respectively.

Abstract translation: 本发明涉及一种模块化组件，其包括要组装在一起的至少两个模块，并且当组装成电气互连时，用于将微波信号从其中一个模块的电子电路传送到另一个模块的电子电路，所述模块化组件 电子电路设置在相应的封装中。 所述电子电路中的一个包括光学连接到至少一个光纤的至少一个光电子部件。 两个封装适于接收具有中心导体的微波馈通，该中心导体的轴向端分别与属于每个所述电子电路的导电轨道接触。