公开(公告)号：US4274389A

公开(公告)日：1981-06-23

申请号：US130933

申请日：1980-03-17

申请人： Arnold G. White ,  James K. Tarbet ,  Dennis A. Vanness ,  Gordon J. Woods ,  William F. H. Micklethwaite

发明人： Arnold G. White ,  James K. Tarbet ,  Dennis A. Vanness ,  Gordon J. Woods ,  William F. H. Micklethwaite

IPC分类号： B28D5/00 ,  B28D5/04 ,  B28D1/08 ,  B26D1/54

CPC分类号： B28D5/045 ,  B28D5/0088 ,  Y10T83/242 ,  Y10T83/7264

摘要： A cutting apparatus for slicing semiconductor materials into wafers is disclosed.The cutting apparatus broadly comprises a pair of spaced-apart co-planar rotatable wheels, a continuous metallic band passing over said wheels, means for driving one of said wheels to move said band unidirectionally through a path encompassing said wheels and through a linear cutting region, means for moving the other wheel towards and away from the driven wheel for tensioning the metallic band, workpiece support means stationed in the cutting region adapted to raise a workpiece to the metallic band at a controlled speed, means for supplying an abrasive slurry to said metallic band in the cutting region upstream of the workpiece, and guide-wipers upstream and downstream of the cutting region each comprising a pair of opposed, laterally and linearly offset wipers for dampening lateral motion of the metallic band, maintaining the band in alignment across the workpiece and wiping the band of abrasive slurry before the band passes over the driven wheel.

摘要翻译： 公开了一种用于将半导体材料切割成晶片的切割装置。 切割装置广泛地包括一对间隔开的共面可旋转轮，穿过所述轮的连续金属带，用于驱动所述轮之一的装置，以将所述带单向移动通过包围所述轮的路径并通过线性切割区 用于将另一个车轮朝向和远离所述从动轮移动以用于张紧所述金属带的装置，驻留在所述切割区域中的工件支撑装置，其适于以受控的速度将工件升高到所述金属带;用于将磨料浆料供应到所述 金属带在工件上游的切割区域中，以及在切割区域的上游和下游的引导擦拭器，每个包括一对相对的，横向和线性偏移的擦拭器，用于抑制金属带的横向运动， 工件，并在带通过从动轮之前擦拭磨料浆料带。