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公开(公告)号：US20120057856A1
公开(公告)日：2012-03-08
申请号：US12875720
申请日：2010-09-03
CPC分类号： H01J37/28 , H01J37/18 , H01J2237/184 , H01J2237/2001 , H01J2237/2817
摘要： One embodiment relates to an apparatus for vacuum-compatible substrate thermal management. The apparatus includes a load-lock chamber coupled to a vacuum chamber, a light-emitting diode array, and a substrate stage. The load-lock chamber is configured to hold a substrate prior to the substrate being transferred into the vacuum chamber, and a substrate stage is configured to hold the substrate in the vacuum chamber. The light-emitting diode array is configured to warm the substrate while the substrate is in the load-lock chamber. Other features, aspects and embodiments are also disclosed.
摘要翻译： 一个实施例涉及用于真空兼容的基板热管理的装置。 该装置包括耦合到真空室的负载锁定室，发光二极管阵列和衬底台。 负载锁定室被配置为在将衬底转移到真空室之前保持衬底，并且衬底台被配置为将衬底保持在真空室中。 发光二极管阵列被配置为在衬底处于装载锁定室的同时加热衬底。 还公开了其它特征，方面和实施例。
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公开(公告)号：US08693856B2
公开(公告)日：2014-04-08
申请号：US12875720
申请日：2010-09-03
IPC分类号： F24H1/34
CPC分类号： H01J37/28 , H01J37/18 , H01J2237/184 , H01J2237/2001 , H01J2237/2817
摘要： One embodiment relates to an apparatus for vacuum-compatible substrate thermal management. The apparatus includes a load-lock chamber coupled to a vacuum chamber, a light-emitting diode array, and a substrate stage. The load-lock chamber is configured to hold a substrate prior to the substrate being transferred into the vacuum chamber, and a substrate stage is configured to hold the substrate in the vacuum chamber. The light-emitting diode array is configured to warm the substrate while the substrate is in the load-lock chamber. Other features, aspects and embodiments are also disclosed.
摘要翻译： 一个实施例涉及用于真空兼容的基板热管理的装置。 该装置包括耦合到真空室的负载锁定室，发光二极管阵列和衬底台。 负载锁定室被配置为在将衬底转移到真空室之前保持衬底，并且衬底台被配置为将衬底保持在真空室中。 发光二极管阵列被配置为在衬底处于装载锁定室的同时加热衬底。 还公开了其它特征，方面和实施例。
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