Deionized water conditioning system and methods
    1.
    发明授权
    Deionized water conditioning system and methods 有权
    去离子水调节系统及方法

    公开(公告)号:US09138784B1

    公开(公告)日:2015-09-22

    申请号:US12961274

    申请日:2010-12-06

    IPC分类号: B08B3/00 B08B3/10 B01D19/00

    摘要: An apparatus for conditioning deionized water and delivering it to a semiconductor wafer in a post electrofill module includes a degassing station configured to remove dissolved gas from the deionized water flow, a heating station configured to heat the deionized water flow, and a nozzle configured to deliver the deionized water flow to the wafer. The heating and degassing are performed before the delivery of the deionized water flow to the wafer. In some implementations the degassing station includes a contact degasser or an inert gas bubbler, and the heating station is configured to heating the deionized water flow to a temperature of between about 35-40° C. In some embodiments the deionized water flow is passed through the degassing station before being passed through the heating station.

    摘要翻译: 一种用于调节去离子水并将其输送到后电解电池模块中的半导体晶片的设备包括:脱气站,其被配置为从去离子水流中除去溶解的气体;加热站,被配置为加热去离子水流;以及喷嘴, 去离子水流向晶片。 在将去离子水流输送到晶片之前进行加热和脱气。 在一些实施方案中,脱气站包括接触脱气器或惰性气体起泡器,并且加热站配置为将去离子水流加热到约35-40℃之间的温度。在一些实施方案中,去离子水流通过 脱气站通过加热站。