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公开(公告)号:US5236852A
公开(公告)日:1993-08-17
申请号:US950333
申请日:1992-09-24
IPC分类号: H01L21/265 , H01L21/28 , H01L21/768 , H01L23/485
CPC分类号: H01L23/485 , H01L21/76838 , H01L2924/0002 , Y10S148/019
摘要: An electrical contact (46) to a phosphorous doped polysilicon gate electrode (18) is formed by preventing arsenic, from a source and drain implant, from doping a portion (22) of the polysilicon gate electrode (18). A photoresist mask (20) covers a portion (22) of the polysilicon gate electrode (18) during the implant, thus preventing it from being doped. An electrical contact (46) is then formed to the masked portion (22) of the polysilicon gate electrode (18).