公开(公告)号：US08238107B2

公开(公告)日：2012-08-07

申请号：US12713309

申请日：2010-02-26

申请人： Jen-Chuan Yeh ,  Kuo-Ting Lee

发明人： Jen-Chuan Yeh ,  Kuo-Ting Lee

IPC分类号： H01R4/22

CPC分类号： B81C1/00269 ,  B81C1/00888

摘要： A cap for a MEMS package includes a main body having a bottom surface, a top surface, a plurality of accommodations recessed from the bottom surface towards the top surface, and a plurality of slots recessed from the top surface towards the bottom surface in a way that the top surface is defined into a plurality of regions corresponding to the accommodations respectively. After completion of the MEMS package, the package can be cut along the slots into a plurality of MEMS package units, such that the cutting work can be done quickly and the cutting burrs can be minimized.

摘要翻译： 一种用于MEMS封装的盖包括具有底表面的主体，顶表面，从底表面朝向顶表面凹进的多个托架以及以顶部表面向底表面凹陷的多个槽 顶表面分别被定义成对应于住宿的多个区域。 在MEMS封装完成之后，封装可以沿着狭槽切割成多个MEMS封装单元，使得可以快速地进行切割加工，并且能够使切割毛刺最小化。

公开(公告)号：US20110180924A1

公开(公告)日：2011-07-28

申请号：US12707940

申请日：2010-02-18

申请人： Jyong-Yue TIAN ,  Jen-Chuan Yeh

发明人： Jyong-Yue TIAN ,  Jen-Chuan Yeh

IPC分类号： H01L23/04

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  H01L23/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A MEMS module package includes a carrier, a lid capped on the carrier, a spacer disposed between the carrier and the lid, and a chip mounted on the spacer and electrically connected with the carrier. The spacer has a channel in communication between a chamber and a receiving hole of the lid, and the chip is received in the chamber of the lid and corresponding to the channel of the spacer. Therefore, an external signal can be transmitted from the receiving hole of the lid into the chamber of the lid through the channel of the spacer so as be received by the chip.

摘要翻译： MEMS模块封装包括载体，盖在载体上的盖，设置在载体和盖之间的间隔件，以及安装在间隔件上并与载体电连接的芯片。 间隔件具有在室和盖的接收孔之间连通的通道，并且芯片被容纳在盖的室中并且对应于间隔件的通道。 因此，外部信号可以通过间隔物的通道从盖的接收孔传送到盖的室中，以便被芯片接收。

公开(公告)号：US20110293119A1

公开(公告)日：2011-12-01

申请号：US12855861

申请日：2010-08-13

申请人： Jen-Chuan YEH ,  Jyong-Yue Tian ,  Kuo-Ting Lee

发明人： Jen-Chuan YEH ,  Jyong-Yue Tian ,  Kuo-Ting Lee

IPC分类号： H04R25/00

CPC分类号： H04R19/005

摘要： An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.

摘要翻译： MEM麦克风载体模块由基板和盖板组成。 基板包括空间层，底层，从空间层的顶侧凹陷的凹部和在凹部中形成的凹槽。 底层具有限定预定图案的金属板并暴露在其表面之外。 底层是通过金属板和绝缘胶的模制而形成的单层结构，使得基底更薄以减少生产成本并且比现有技术花费更少的装配时间。

公开(公告)号：US08254619B2

公开(公告)日：2012-08-28

申请号：US12855861

申请日：2010-08-13

申请人： Jen-Chuan Yeh ,  Jyong-Yue Tian ,  Kuo-Ting Lee

发明人： Jen-Chuan Yeh ,  Jyong-Yue Tian ,  Kuo-Ting Lee

IPC分类号： H04R21/02

CPC分类号： H04R19/005

摘要： An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.

摘要翻译： MEM麦克风载体模块由基板和盖板组成。 基板包括空间层，底层，从空间层的顶侧凹陷的凹部和在凹部中形成的凹槽。 底层具有限定预定图案的金属板并暴露在其表面之外。 底层是通过金属板和绝缘胶的模制而形成的单层结构，使得基底更薄以减少生产成本并且比现有技术花费更少的装配时间。

公开(公告)号：US20110174532A1

公开(公告)日：2011-07-21

申请号：US12713309

申请日：2010-02-26

申请人： Jen-Chuan YEH ,  Kuo-Ting Lee

发明人： Jen-Chuan YEH ,  Kuo-Ting Lee

IPC分类号： H05K5/00

CPC分类号： B81C1/00269 ,  B81C1/00888

摘要： A cap for a MEMS package includes a main body having a bottom surface, a top surface, a plurality of accommodations recessed from the bottom surface towards the top surface, and a plurality of slots recessed from the top surface towards the bottom surface in a way that the top surface is defined into a plurality of regions corresponding to the accommodations respectively. After completion of the MEMS package, the package can be cut along the slots into a plurality of MEMS package units, such that the cutting work can be done quickly and the cutting burrs can be minimized.

摘要翻译： 一种用于MEMS封装的盖包括具有底表面的主体，顶表面，从底表面朝向顶表面凹进的多个托架以及以顶部表面向底表面凹陷的多个槽 顶表面分别被定义成对应于住宿的多个区域。 在MEMS封装完成之后，封装可以沿着狭槽切割成多个MEMS封装单元，使得可以快速地进行切割加工，并且能够使切割毛刺最小化。

公开(公告)号：US06742931B2

公开(公告)日：2004-06-01

申请号：US10133279

申请日：2002-04-29

申请人： Chau-Chang Chou ,  Binghung Luo ,  Jen-Chuan Yeh

发明人： Chau-Chang Chou ,  Binghung Luo ,  Jen-Chuan Yeh

IPC分类号： F16C2906

CPC分类号： F16C33/3706 ,  F16C29/0609 ,  F16C29/0638 ,  Y10T74/19777

摘要： A rolling ball separator structure of a linear drive member includes multiple separators mounted between the multiple rolling balls and each having a body and an outer ring structure. Thus, the body may be deformed elastically, thereby preventing the multiple separators from interfering with the return face of the rolling path during the returning process of the rolling balls, and thereby absorbing the gap variation of the uneven force during the returning process of the rolling balls, and the outer ring structure may maintain the relative position of the rolling balls, so that the rolling balls will not collide directly during the returning process.

摘要翻译： 线性驱动构件的滚珠分离器结构包括多个分离器，其安装在多个滚珠之间，每个具有主体和外环结构。 因此，主体可能弹性变形，从而防止多个隔板在滚珠返回过程中与滚动路径的返回面相干扰，从而吸收轧制返回过程中的不均匀力的间隙变化 球，并且外圈结构可以保持滚珠的相对位置，使得滚珠在返回过程中不会直接碰撞。