公开(公告)号：US20070176847A1

公开(公告)日：2007-08-02

申请号：US11323116

申请日：2005-12-30

Applicant: Kamalesh Shah ,  Thomas Holder ,  Jennifer Colegrove ,  Maximino Vasquez ,  Roy Karunakaran ,  Yasaman Ghazizadeh ,  Surinder Tuli ,  Ralph Mesmer

Inventor： Kamalesh Shah ,  Thomas Holder ,  Jennifer Colegrove ,  Maximino Vasquez ,  Roy Karunakaran ,  Yasaman Ghazizadeh ,  Surinder Tuli ,  Ralph Mesmer

IPC: G09G5/00

CPC classification number: G09G5/003 ,  G06F1/1616 ,  G06F1/162 ,  G06F1/1637 ,  G06F1/1647 ,  G06F1/1684 ,  G06F1/3218 ,  G06F3/1423 ,  G09G3/36 ,  G09G2300/0456 ,  G09G2330/021 ,  G09G2360/144

Abstract: A method and system to control power consumption of a display system includes using a low power display and a normal power display. The low power display may be a reflective display and may be used when the environment is bright. The normal power display may be a transmissive display and may be used when the environment is not as bright.

Abstract translation: 用于控制显示系统的功耗的方法和系统包括使用低功率显示和正常功率显示。 低功率显示器可以是反射显示器，并且可以在环境亮时使用。 正常功率显示可以是透射显示器，并且可以在环境不那么亮时使用。

公开(公告)号：US06700138B2

公开(公告)日：2004-03-02

申请号：US10081146

申请日：2002-02-25

Applicant: Stanford W. Crane, Jr. ,  Jennifer Colegrove ,  Zsolt Horvath ,  Myoung-soo Jeon ,  Joshua Nickel ,  Lei-Ming Yang

Inventor： Stanford W. Crane, Jr. ,  Jennifer Colegrove ,  Zsolt Horvath ,  Myoung-soo Jeon ,  Joshua Nickel ,  Lei-Ming Yang

IPC: H01L3300

CPC classification number: G02B6/4292 ,  G02B6/4204 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4263 ,  G02B6/4286

Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.