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    Anisotropic conductive film forming composition
    1.
    发明授权
    Anisotropic conductive film forming composition 有权
    各向异性导电膜形成组合物

    公开(公告)号：US07700007B2

    公开(公告)日：2010-04-20

    申请号：US11273160

    申请日：2005-11-14

    申请人： Ki Sung Jung ,  Jeong Ku Kang ,  Jung Sik Choi ,  Jong Hwa Lee ,  Hyoun Young Kim ,  Tu Won Chang

    发明人： Ki Sung Jung ,  Jeong Ku Kang ,  Jung Sik Choi ,  Jong Hwa Lee ,  Hyoun Young Kim ,  Tu Won Chang

    IPC分类号： H01B1/00 ,  H01B1/22 ,  C08K3/08

    CPC分类号： C08K3/08 ,  H05K3/323

    摘要： Disclosed herein is an anisotropic conductive film forming composition, including at least one polymer comprising a polymer containing a silane group; at least one polymerizable compound; and a plurality of conductive particles. The at least one polymer may include an elastomeric polymer and a filler polymer, at least one of which contains a silane group. The at least one polymerizable compound may include a cross-linking agent and/or a polymerization reaction enhancer. The cross-linking agent may also have a silane group. In addition, the film forming composition may include a solvent. The film forming composition is advantageous in that the resulting anisotropic conductive film exhibits enhanced peel and adhesive strength and low electrical contact resistance.

    摘要翻译： 本文公开了各向异性导电膜形成组合物，其包括至少一种包含含有硅烷基团的聚合物的聚合物; 至少一种可聚合化合物; 和多个导电粒子。 至少一种聚合物可以包括弹性体聚合物和填料聚合物，其中至少一种含有硅烷基团。 所述至少一种可聚合化合物可包括交联剂和/或聚合反应增强剂。 交联剂也可以具有硅烷基。 此外，成膜组合物可以包括溶剂。 成膜组合物的优点在于所得到的各向异性导电膜具有增强的剥离和粘合强度以及低的接触电阻。