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公开(公告)号：USD487434S1
公开(公告)日：2004-03-09
申请号：US29174641
申请日：2003-01-20
申请人： Robert J. Monson , Douglas H. Azinger , Julia A. Neuman , Michael E. Smith , Jianhua (Jack) Yan
设计人： Robert J. Monson , Douglas H. Azinger , Julia A. Neuman , Michael E. Smith , Jianhua (Jack) Yan
CPC分类号： A47B2200/0073
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2.发明授权Method and apparatus for the integration of a VCSEL flex with a parallel optical transceiver package 失效用于将VCSEL flex与并行光收发器封装集成的方法和装置公开(公告)号：US07242840B1
公开(公告)日：2007-07-10
申请号：US10773098
申请日：2004-02-05
IPC分类号： G02B6/00
CPC分类号： G02B6/4249 , G02B6/4228 , G02B6/4239 , G02B6/4246 , G02B6/4292
摘要： A method of integrating an optoelectronic device, for example a vertical cavity surface emitting laser, onto the electronic substrate of a parallel optical transceiver package by positioning and maintaining the exact relative alignment of the optoelectronic device relative to the electronic substrate for application of adhesive and curing. The method includes the utilization of a multi-piece fixture which clamps the elements into position and maintains position throughout the curing process. Alternatively, the fixture can comprise a unitary assembly for clamping the elements into position and maintaining their position throughout the curing process.
摘要翻译： 通过定位和保持光电子器件相对于电子基片的精确相对对准来将光电器件（例如垂直腔表面发射激光器）集成到并行光收发器封装的电子衬底上的方法，用于施加粘合剂和固化 。 该方法包括利用多片固定装置，其将元件夹持在适当的位置并且在整个固化过程中保持位置。 或者，夹具可以包括用于将元件夹持在适当位置并在整个固化过程中保持其位置的整体组件。
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3.发明授权Method and apparatus for the integration of a VCSEL flex with a parallel optical transceiver package 失效用于将VCSEL flex与并行光收发器封装集成的方法和装置公开(公告)号：US07035521B2
公开(公告)日：2006-04-25
申请号：US10640583
申请日：2003-08-13
IPC分类号： G02B6/00
CPC分类号： G02B6/4249 , G02B6/4228 , G02B6/4239 , G02B6/4246 , G02B6/4292
摘要： A method of integrating an optoelectronic device, for example a vertical cavity surface emitting laser, onto the electronic substrate of a parallel optical transceiver package by positioning and maintaining the exact relative alignment of the optoelectronic device relative to the electronic substrate for application of adhesive and curing. The method includes the utilization of a multi-piece fixture which clamps the elements into position and maintains position throughout the curing process. Alternatively, the fixture can comprise a unitary assembly for clamping the elements into position and maintaining their position throughout the curing process.
摘要翻译： 通过定位和保持光电子器件相对于电子基片的精确相对对准来将光电器件（例如垂直腔表面发射激光器）集成到并行光收发器封装的电子衬底上的方法，用于施加粘合剂和固化 。 该方法包括利用多片固定装置，其将元件夹持在适当的位置并且在整个固化过程中保持位置。 或者，夹具可以包括用于将元件夹持在适当位置并在整个固化过程中保持其位置的整体组件。
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公开(公告)号：USD492676S1
公开(公告)日：2004-07-06
申请号：US29174640
申请日：2003-01-20
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公开(公告)号：US07135704B2
公开(公告)日：2006-11-14
申请号：US10641398
申请日：2003-08-14
CPC分类号： H01S5/02256 , H01L2924/0002 , H01S5/0021 , H01S5/183 , H01S5/423 , H01L2924/00
摘要： A VCSEL settling fixture provides for a plurality of VCSEL chip packages to be selectively tested within a burn-in or environmental chamber having a remote pendant controller. The settling fixture includes a mounting frame including a plurality of recesses and throughbores for positioning and aligning the VCSEL's on the mounting frame. The mounting frame further includes a plurality of terminal blocks in proximity to the recesses for interconnecting the mounting frame with the controller. An activation system including a plurality of electrical contacts electrically connects the individual VCSEL chip packages with the terminal blocks so that the controller can selectively trigger a laser output from the VCSEL chip package.
摘要翻译： VCSEL沉降夹具提供多个VCSEL芯片封装，以在具有远程侧挂控制器的老化或环境室内进行选择性测试。 沉降固定装置包括安装框架，该安装框架包括用于在安装框架上定位和对准VCSEL的多个凹槽和通孔。 安装框架还包括靠近凹部的多个端子块，用于将安装框架与控制器互连。 包括多个电触点的激活系统将各个VCSEL芯片封装与端子块电连接，使得控制器能够选择性地触发来自VCSEL芯片封装的激光输出。
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