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    Vacuum type pickup apparatus and vacuum type pickup Method
    2.
    发明申请
    Vacuum type pickup apparatus and vacuum type pickup Method 有权
    真空式拾取装置和真空式拾取方法

    公开(公告)号：US20080129063A1

    公开(公告)日：2008-06-05

    申请号：US11987482

    申请日：2007-11-30

    申请人： Jin-won Kang ,  Jun-young Lee ,  Jung-hyeon Kim

    发明人： Jin-won Kang ,  Jun-young Lee ,  Jung-hyeon Kim

    IPC分类号： A47J45/00

    CPC分类号： H01L21/6838

    摘要： A vacuum type pickup apparatus may include an absorption pad having an absorption inlet for contacting and/or picking up an object. A pad holder may be connected to the absorption pad. The pad holder may also have a vacuum line. A separator may be provided in the pad holder for forcibly releasing the object from the absorption inlet of the absorption pad. During the forcible release of the object, the air around the absorption pad may be drawn into the pad holder, thus reducing or preventing the potential contamination by impurities of the object as well as the equipment around the object. Also, an additional vacuum extinguisher may not be required, thus simplifying the structure of the vacuum type pickup apparatus and reducing installation costs. Furthermore, the object may be picked up and released in a relatively expedient, safe, and accurate manner, despite the suction force of the vacuum that may be maintained in the pad holder.

    摘要翻译： 真空型拾取装置可以包括具有用于接触和/或拾取物体的吸收入口的吸收垫。 吸垫保持器可以连接到吸收垫。 垫座也可以具有真空管线。 可以在衬垫保持器中设置分离器，以从吸收垫的吸收入口强制地释放物体。 在物体的强制释放期间，吸收垫周围的空气可以被吸入到垫保持器中，从而减少或防止物体的杂质以及物体周围的设备的潜在污染。 此外，可以不需要附加的真空灭火器，因此简化了真空型拾取装置的结构并降低了安装成本。 此外，尽管可以在垫保持器中保持真空的吸力，但是物体可以以相对便利，安全和准确的方式被拾取和释放。

    SOCKET FOR TESTING SEMICONDUCTOR PACKAGE
    5.
    发明申请
    SOCKET FOR TESTING SEMICONDUCTOR PACKAGE 失效
    用于测试半导体封装的插座

    公开(公告)号：US20080113524A1

    公开(公告)日：2008-05-15

    申请号：US11940044

    申请日：2007-11-14

    申请人： Seoung-Su HA ,  Jin-Won KANG ,  Jung-Hyeon KIM ,  Se-Jun YU

    发明人： Seoung-Su HA ,  Jin-Won KANG ,  Jung-Hyeon KIM ,  Se-Jun YU

    IPC分类号： H01R13/20

    CPC分类号： G01R1/0466 ,  G01R1/0483 ,  H01R11/30 ,  H01R12/7076 ,  H01R13/2407

    摘要： Example embodiments of the present invention include a socket for testing a semiconductor package. The socket comprises a body having a through hole. A lower magnet is disposed in a lower region of the through hole, and a first type magnetic pole of the lower magnet is directed upward. An upper magnet is disposed in an upper region of the through hole, wherein the first type magnetic pole of the upper magnet is directed toward the lower magnet. The upper and lower magnets are structured to absorb a shock wave which is generated when the semiconductor package is arranged for testing. A conductive medium is disposed between the lower magnet and the upper magnet to electrically couple contactors of the semiconductor package to a base substrate of the socket.

    摘要翻译： 本发明的示例性实施例包括用于测试半导体封装的插座。 插座包括具有通孔的主体。 下磁铁配置在通孔的下部区域，下磁铁的第一型磁极向上方。 上磁体设置在通孔的上部区域中，其中上磁体的第一型磁极指向下磁体。 上磁铁和下磁体被构造成吸收当半导体封装被布置用于测试时产生的冲击波。 导电介质设置在下磁体和上磁体之间，以将半导体封装的接触器电耦合到插座的基底。

    Socket for testing semiconductor package
    6.
    发明授权
    Socket for testing semiconductor package 失效
    用于测试半导体封装的插座

    公开(公告)号：US07419378B2

    公开(公告)日：2008-09-02

    申请号：US11940044

    申请日：2007-11-14

    申请人： Seoung-Su Ha ,  Jin-Won Kang ,  Jung-Hyeon Kim ,  Se-Jun Yu

    发明人： Seoung-Su Ha ,  Jin-Won Kang ,  Jung-Hyeon Kim ,  Se-Jun Yu

    IPC分类号： H01R11/30

    CPC分类号： G01R1/0466 ,  G01R1/0483 ,  H01R11/30 ,  H01R12/7076 ,  H01R13/2407

    摘要： Example embodiments of the present invention include a socket for testing a semiconductor package. The socket comprises a body having a through hole. A lower magnet is disposed in a lower region of the through hole, and a first type magnetic pole of the lower magnet is directed upward. An upper magnet is disposed in an upper region of the through hole, wherein the first type magnetic pole of the upper magnet is directed toward the lower magnet. The upper and lower magnets are structured to absorb a shock wave which is generated when the semiconductor package is arranged for testing. A conductive medium is disposed between the lower magnet and the upper magnet to electrically couple contactors of the semiconductor package to a base substrate of the socket.

    摘要翻译： 本发明的示例性实施例包括用于测试半导体封装的插座。 插座包括具有通孔的主体。 下磁铁配置在通孔的下部区域，下磁铁的第一型磁极向上方。 上磁体设置在通孔的上部区域中，其中上磁体的第一型磁极指向下磁体。 上磁铁和下磁体被构造成吸收当半导体封装被布置用于测试时产生的冲击波。 导电介质设置在下磁体和上磁体之间，以将半导体封装的接触器电耦合到插座的基底。