公开(公告)号：US5378307A

公开(公告)日：1995-01-03

申请号：US54108

申请日：1993-04-28

申请人： Steven L. Bard ,  Gerald A. Bendz ,  Michael J. Canestaro ,  John R. Chapura ,  Edward J. Frankoski ,  Michael S. Horan ,  Jeffrey D. Jones ,  James S. Kamperman ,  John R. Kjelgaard, Jr. ,  Jack M. McCreary

发明人： Steven L. Bard ,  Gerald A. Bendz ,  Michael J. Canestaro ,  John R. Chapura ,  Edward J. Frankoski ,  Michael S. Horan ,  Jeffrey D. Jones ,  James S. Kamperman ,  John R. Kjelgaard, Jr. ,  Jack M. McCreary

IPC分类号： B05C5/00 ,  B05B15/04 ,  C23F1/08 ,  H01L23/12 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  B08B3/02

CPC分类号： H05K3/0085 ,  B05B15/0406 ,  Y02P70/36

摘要： A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occurring within the same housing chamber which serves to collect the first fluid.

摘要翻译： 一种用于将第一和第二流体（例如蚀刻剂和水）施加到以预定速率穿过设备的制品（例如电路板）的流体处理装置和方法。 第一流体冲击在物品的表面上，然后收集在设备的共用外壳内。 第二流体冲击到制品的表面上并收集在相同的壳体内，但是在与收集的第一流体分开的位置处，以至少部分地防止其混合。 用于实现流体冲击的优选方式包括单独的流体注射器，每个流体注射器在其中包括至少两排流体喷射喷射器。 收集的流体各自返回到相应的冲击装置。 使用供应第二流体的泵来实现第二流体的补充，同时该装置还包括以与第二流体的供给速率相似的速率有效地去除第二流体的装置（例如排水管）。 使用位于第一流体冲击装置相对（例如，在相对侧）上的合适的装置（例如，双辊），第一流体也保持在制品表面上方的确定水平。 第二流体的相似水平保持也是可能的。 还定义了所收集的第二流体的级联，其发生在用于收集第一流体的相同壳体室内。