公开(公告)号：US11646531B2

公开(公告)日：2023-05-09

申请号：US17523356

申请日：2021-11-10

申请人： Jong Cheon Shin ,  Dong Ho Ha

发明人： Jong Cheon Shin ,  Dong Ho Ha

IPC分类号： H01R13/627 ,  H01R12/85 ,  H01R13/42 ,  H01R12/73

CPC分类号： H01R13/6275 ,  H01R12/73 ,  H01R12/85 ,  H01R13/42

摘要： Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

公开(公告)号：US20220158386A1

公开(公告)日：2022-05-19

申请号：US17523356

申请日：2021-11-10

申请人： Jong Cheon Shin ,  Dong Ho Ha

发明人： Jong Cheon Shin ,  Dong Ho Ha

IPC分类号： H01R13/627 ,  H01R12/85

摘要： Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

公开(公告)号：US09823299B2

公开(公告)日：2017-11-21

申请号：US14784071

申请日：2014-02-11

申请人： Jong Cheon Shin ,  Dong Ho Ha

发明人： Jong Cheon Shin ,  Dong Ho Ha

IPC分类号： G01R31/28 ,  G01R1/04 ,  G01R3/00

CPC分类号： G01R31/2884 ,  G01R1/0433 ,  G01R3/00

摘要： Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.

公开(公告)号：US20160054384A1

公开(公告)日：2016-02-25

申请号：US14784071

申请日：2014-02-11

申请人： Jong Cheon SHIN ,  Dong Ho HA

发明人： Jong Cheon SHIN ,  Dong Ho HA

IPC分类号： G01R31/28 ,  G01R3/00

CPC分类号： G01R31/2884 ,  G01R1/0433 ,  G01R3/00

摘要： Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.

摘要翻译： 提供一种用于半导体芯片测试的插座及其制造方法，用于半导体芯片测试的插座包括：薄膜层; 半导体芯片测试端子，设置在膜层上并连接到半导体芯片的端子; 以及设置在所述膜层上并连接到所述半导体芯片的接地端子的导电弹性垫。