公开(公告)号：US06398631B1

公开(公告)日：2002-06-04

申请号：US09681160

申请日：2001-02-02

Applicant: Gary L. Anderson ,  Judy Schmidt ,  Brent Teasley ,  Dennis Buese ,  James Callahan ,  Randy Gene Loeschen

Inventor： Gary L. Anderson ,  Judy Schmidt ,  Brent Teasley ,  Dennis Buese ,  James Callahan ,  Randy Gene Loeschen

IPC: B24B4702

CPC classification number: B24B37/345 ,  H01L21/67745

Abstract: A system for facilitating transfer of a semiconductor wafer into or out of a wafer carrier of a polishing or lapping machine without contacting a face of the wafer. The system includes a wafer transport suitable for placement above the carrier, the transport having at least one open cavity with a size and shape suitable for registering alignment with an opening of the carrier. The cavity and opening together form a compartment adapted to receive and hold the wafer. A liquid delivery conduit having an outlet located above an abrading member of the machine is arranged to deliver a liquid to a position generally beneath the transport. A method for transferring the wafer to or from the machine includes delivering liquid beneath the wafer. The wafer thereby moves between a first position resting on the abrading member and a second position spaced above the abrading member where a tool may engage the edge of the wafer for holding the wafer without contacting the face of the wafer.

Abstract translation: 一种用于促进半导体晶片进入或抛出抛光或研磨机的晶片载体而不接触晶片的表面的系统。 该系统包括适于放置在载体上方的晶片传送装置，该传送装置具有至少一个开口空腔，其尺寸和形状适合于与载体的开口对准。 空腔和开口一起形成适于容纳和保持晶片的隔间。 具有位于机器的研磨部件上方的出口的液体输送管道布置成将液体输送到通常位于输送器下方的位置。 将晶片转移到或从机器转移的方法包括在晶片下方输送液体。 因此，晶片因此在搁置在研磨部件上的第一位置和在研磨部件上方间隔开的第二位置之间移动，其中工具可以接合晶片的边缘以保持晶片而不接触晶片的表面。