公开(公告)号：US06960265B2

公开(公告)日：2005-11-01

申请号：US10104094

申请日：2002-03-21

申请人： Yong-Woo Heo ,  June-Ing Gill ,  Mi-Kyoung Lee ,  Hyun-Gi Cho

发明人： Yong-Woo Heo ,  June-Ing Gill ,  Mi-Kyoung Lee ,  Hyun-Gi Cho

IPC分类号： H01L21/02 ,  G01N1/32 ,  G01N1/34 ,  H01L21/00 ,  B08B7/04

CPC分类号： H01L21/67051 ,  G01N1/32 ,  G01N2001/4061 ,  Y10S134/902

摘要： An apparatus and method for automatically collecting metallic impurities of a semiconductor wafer. In one aspect, an apparatus includes an air tight process chamber including a loading unit for loading the semiconductor wafer and unloading unit for unloading the semiconductor wafer; a vapor phase decomposition unit disposed in the process chamber for decomposing a silicon oxide layer on the semiconductor wafer; and a scanning unit disposed in the process chamber for scanning the semiconductor wafer to collect the metallic impurities. The scanning unit includes a scanning solution bottle for obtaining scanning solution that is used for absorbing metallic impurities on the semiconductor wafer; a scanning arm capable of downward, upward, and rotational movement; and a nozzle coupled to the scanning arm for drawing in scanning solution from the scanning solution bottle, and for forming a droplet of scanning solution that cohers to the nozzle when scanning a semiconductor wafer to collect metallic impurities.

摘要翻译： 一种用于自动收集半导体晶片的金属杂质的装置和方法。 一方面，一种装置包括：气密处理室，包括用于装载半导体晶片的装载单元和用于卸载半导体晶片的卸载单元; 设置在所述处理室中用于分解所述半导体晶片上的氧化硅层的气相分解单元; 以及设置在处理室中用于扫描半导体晶片以收集金属杂质的扫描单元。 扫描单元包括用于获得用于吸收半导体晶片上的金属杂质的扫描溶液的扫描溶液瓶; 能够向下，向上和旋转运动的扫描臂; 以及联接到所述扫描臂的喷嘴，用于从所述扫描溶液瓶吸取扫描溶液，并且在扫描半导体晶片以形成金属杂质时，形成与所述喷嘴相邻的扫描溶液液滴。

公开(公告)号：US07081182B2

公开(公告)日：2006-07-25

申请号：US10205621

申请日：2002-07-26

申请人： Jae-Jun Ryu ,  Kyung-Dae Kim ,  June-Ing Gill ,  Yong-Woo Heo

发明人： Jae-Jun Ryu ,  Kyung-Dae Kim ,  June-Ing Gill ,  Yong-Woo Heo

IPC分类号： C23F1/00 ,  H01L21/306

CPC分类号： H01L22/26

摘要： The present invention relates to a method and apparatus for automatically measuring the concentration of total organic carbon (TOC) in chemicals and ultra-pure water that are used in a wet etch process. The apparatus includes a sampling line extending from a processing bath, and a pump, for extracting a fluid sample from the processing bath, a buffer for filtering foreign material or air bubbles from the fluid, and an analyzer for analyzing the concentration of TOC in the fluid.