公开(公告)号：US20080145957A1

公开(公告)日：2008-06-19

申请号：US11950907

申请日：2007-12-05

申请人： Young-Sun Lee ,  Ho-Seong Kang ,  Jung-Ho Kwak ,  Bong-su Kim ,  Young-Nam Kim ,  Yi-Su Lee

发明人： Young-Sun Lee ,  Ho-Seong Kang ,  Jung-Ho Kwak ,  Bong-su Kim ,  Young-Nam Kim ,  Yi-Su Lee

IPC分类号： H01L21/66 ,  H01L21/67

CPC分类号： H01L21/6838 ,  H01L21/67288 ,  H01L21/67742 ,  H01L22/20

摘要： A wafer transferring robot in semiconductor device fabricating equipment and a method of detecting wafer warpage by using the wafer transferring robot are provided. In the realizing the wafer transferring robot to transfer a wafer, vacuum lines are formed to adsorb a plurality of regions of the wafer. Whether the wafer is warped or not and the extent of warpage are determined in real time, depending on whether the wafer is adsorbed by the vacuum lines. When no warpage occurs on the wafer or when the extent of warpage is slight, the wafer is allowed to be normally processed. When the extent of warpage is too serious to perform a normal process on the wafer, the wafer is previously processed as an error, thereby preventing the waste of time, cost and manpower caused by performing an unnecessary process.

摘要翻译： 提供半导体器件制造设备中的晶片传送机器人以及通过使用晶片传送机器人检测晶片翘曲的方法。 在实现晶片传送机器人传送晶片的过程中，形成真空线以吸附晶片的多个区域。 取决于晶片是否被真空管线吸附，晶片是否翘曲和翘曲程度是实时确定的。 当晶片上没有发生翘曲时或当翘曲程度轻微时，允许晶片被正常处理。 当翘曲程度太严重以致不能在晶片上进行正常处理时，晶片预先作为错误处理，从而防止由于执行不必要的处理而浪费时间，成本和人力。