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    METHOD OF SETTING RECIPES OF A DEFECT TEST
    1.
    发明申请
    METHOD OF SETTING RECIPES OF A DEFECT TEST 审中-公开
    设定缺陷测试的方法

    公开(公告)号：US20080318351A1

    公开(公告)日：2008-12-25

    申请号：US11870344

    申请日：2007-10-10

    申请人： Ho-Seong KANG ,  Bong-Su KIM ,  Young-Nam KIM ,  Joung-Soo KIM ,  Gee-Jun LEE

    发明人： Ho-Seong KANG ,  Bong-Su KIM ,  Young-Nam KIM ,  Joung-Soo KIM ,  Gee-Jun LEE

    IPC分类号： H01L21/02

    CPC分类号： H01L22/20 ,  G01N21/9501 ,  H01L22/12

    摘要： In a method of setting recipes of a defect test, a laser intensity map of a sample is obtained. The laser intensity map is then area-scanned to obtain average laser intensity. Recipes are set based on the average laser intensity. Thus, a laser power set in a defect detector may be constant regardless of inspectors so that the defect detector may have improved defect detection reliability.

    摘要翻译： 在设定缺陷试验配方的方法中，得到样品的激光强度图。 然后对激光强度图进行区域扫描，以获得平均激光强度。 食谱根据平均激光强度设定。 因此，不管检查员如何，在缺陷检测器中设置的激光功率可以是恒定的，使得缺陷检测器可以具有改善的缺陷检测可靠性。

    WAFER TRANSFERRING ROBOT IN SEMICONDUCTOR DEVICE FABRICATION EQUIPMENTAND METHOD OF DETECTING WAFER WARPAGE USING THE SAME
    2.
    发明申请
    WAFER TRANSFERRING ROBOT IN SEMICONDUCTOR DEVICE FABRICATION EQUIPMENTAND METHOD OF DETECTING WAFER WARPAGE USING THE SAME 审中-公开
    半导体器件制造设备中的转子传送机器人及使用该方法检测波纹的方法

    公开(公告)号：US20080145957A1

    公开(公告)日：2008-06-19

    申请号：US11950907

    申请日：2007-12-05

    申请人： Young-Sun Lee ,  Ho-Seong Kang ,  Jung-Ho Kwak ,  Bong-su Kim ,  Young-Nam Kim ,  Yi-Su Lee

    发明人： Young-Sun Lee ,  Ho-Seong Kang ,  Jung-Ho Kwak ,  Bong-su Kim ,  Young-Nam Kim ,  Yi-Su Lee

    IPC分类号： H01L21/66 ,  H01L21/67

    CPC分类号： H01L21/6838 ,  H01L21/67288 ,  H01L21/67742 ,  H01L22/20

    摘要： A wafer transferring robot in semiconductor device fabricating equipment and a method of detecting wafer warpage by using the wafer transferring robot are provided. In the realizing the wafer transferring robot to transfer a wafer, vacuum lines are formed to adsorb a plurality of regions of the wafer. Whether the wafer is warped or not and the extent of warpage are determined in real time, depending on whether the wafer is adsorbed by the vacuum lines. When no warpage occurs on the wafer or when the extent of warpage is slight, the wafer is allowed to be normally processed. When the extent of warpage is too serious to perform a normal process on the wafer, the wafer is previously processed as an error, thereby preventing the waste of time, cost and manpower caused by performing an unnecessary process.

    摘要翻译： 提供半导体器件制造设备中的晶片传送机器人以及通过使用晶片传送机器人检测晶片翘曲的方法。 在实现晶片传送机器人传送晶片的过程中，形成真空线以吸附晶片的多个区域。 取决于晶片是否被真空管线吸附，晶片是否翘曲和翘曲程度是实时确定的。 当晶片上没有发生翘曲时或当翘曲程度轻微时，允许晶片被正常处理。 当翘曲程度太严重以致不能在晶片上进行正常处理时，晶片预先作为错误处理，从而防止由于执行不必要的处理而浪费时间，成本和人力。