Copper powder for solderable and electroconductive paints and process
for producing the same
    2.
    发明授权
    Copper powder for solderable and electroconductive paints and process for producing the same 失效
    用于可焊和导电涂料的铜粉及其制造方法

    公开(公告)号:US5409520A

    公开(公告)日:1995-04-25

    申请号:US154492

    申请日:1993-11-19

    摘要: This invention is to offer a copper powder for solderable and conductive paints which have an improved solderability, excellent adhesion and conductivity.A copper powder for solderable and conductive paints comprising particles of green caterpillar shape is obtained by crushing particulate dendritic copper powder, and has an oil absorption value (JIS K5101) of up to 20 ml/100 g, a maximum particle diameter of up to 44 .mu.m, an average particle diameter of up to 10 .mu.m, and a hydrogen-reduction loss of up to 0.5%. A process for producing this copper powder for solderable and conductive paints comprises: preparing a copper powder comprising particles of a green caterpillar shape having an average particle diameter of up to 10 .mu.m by crushing dendritic copper powder having a maximum diameter of up to 44 .mu.m by means of a crushing apparatus; treating the copper powders thus obtained with a pickling solution consisting of inorganic acids or organic acids to dissolve and remove any oxidation film on the copper powder surface; washing the copper powder with water; spraying a quick drying organic solvent on the copper powders; and hot-air drying the copper powder, thereby obtaining a copper powder having an oil absorption value of up to 20 ml/100 g and a hydrogen-reduction loss of up to 0.5%.

    摘要翻译: 本发明提供一种可焊接和导电涂料的铜粉,其具有改善的可焊性,优异的粘合性和导电性。 通过粉碎颗粒状树枝状铜粉而获得包含绿色毛虫形状的颗粒的可焊性和导电性涂料用铜粉末,其吸油值(JIS K5101)为20ml / 100g以下,最大粒径为44 平均粒径高达10微米,氢还原损失高达0.5%。 制造该可焊性和导电性涂料用铜粉的方法包括:通过粉碎最大直径达44μm的树枝状铜粉,制备包含平均粒径达10μm的绿色毛虫形状的铜粉末 m通过破碎装置; 用由无机酸或有机酸组成的酸洗溶液处理由此获得的铜粉,以溶解并除去铜粉表面上的任何氧化膜; 用水洗铜粉; 在铜粉上喷涂快干有机溶剂; 并对铜粉进行热风干燥,由此得到吸油值高达20ml / 100g的氢氧化还原损失高达0.5%的铜粉末。