公开(公告)号：US07380560B2

公开(公告)日：2008-06-03

申请号：US10843173

申请日：2004-05-11

申请人： In-joon Yeo ,  Il-sang Lee ,  Kang-youn Lee

发明人： In-joon Yeo ,  Il-sang Lee ,  Kang-youn Lee

IPC分类号： B08B3/12

CPC分类号： H01L21/67051 ,  B08B3/12 ,  Y10S134/902

摘要： Wafer cleaning apparatus include a cleaning tub configured to receive a wafer to be cleaned. A wafer cleaning unit coupled to the cleaning tub is configured to provide wafer cleaning solution to the wafer. A probe is positioned in the cleaning tub proximate the wafer. The probe is configured to provide megasonic vibrational energy to a surface of the wafer and/or the wafer cleaning solution to separate contaminants from the surface of the wafer. A probe cleaning unit is configured to provide a probe cleaning solution to the probe to clean the probe. Methods of using the wafer cleaning apparatus are also provided.

摘要翻译： 晶片清洁装置包括配置为接收要清洁的晶片的清洗桶。 耦合到清洁桶的晶片清洁单元被配置为向晶片提供晶片清洁溶液。 探针位于靠近晶片的清洗槽中。 探针被配置为向晶片和/或晶片清洁溶液的表面提供兆声波振动能量以从晶片的表面分离污染物。 探针清洁单元被配置为向探针提供探针清洁溶液以清洁探针。 还提供了使用晶片清洁装置的方法。

公开(公告)号：US20080047576A1

公开(公告)日：2008-02-28

申请号：US11844241

申请日：2007-08-23

申请人： Young-Ok KIM ,  Chang-Ki HONG ,  Kun-Tack LEE ,  In-Gi KIM ,  Woo-Gwan SHIM ,  Jeong-Nam HAN ,  Kang-Youn LEE

发明人： Young-Ok KIM ,  Chang-Ki HONG ,  Kun-Tack LEE ,  In-Gi KIM ,  Woo-Gwan SHIM ,  Jeong-Nam HAN ,  Kang-Youn LEE

IPC分类号： B08B3/12 ,  B08B3/10

CPC分类号： H01L21/67057 ,  H01L21/67034

摘要： In a single-substrate type apparatus for processing a substrate, the apparatus includes a chamber, a bottom panel, a solution supplying part and a substrate holder. The chamber has an upper portion and a lower portion. The bottom panel is detachably connected to the lower portion. The solution supplying part is connected to the bottom panel to supply a processing solution to the substrate in the chamber. The substrate holder provides the substrate into the chamber, the substrate holder holding both side portions of the substrate such that the substrate is vertically arranged.

摘要翻译： 在用于处理基板的单基板型装置中，该装置包括室，底板，溶液供应部和基板保持件。 腔室具有上部和下部。 底板可拆卸地连接到下部。 溶液供应部分连接到底板，以将处理溶液供应到室中的基板。 衬底保持器将衬底提供到腔室中，衬底保持器保持衬底的两侧部分，使得衬底垂直布置。