Heatsink apparatus and electronic device having the same
    1.
    发明授权
    Heatsink apparatus and electronic device having the same 有权
    散热装置和具有该散热装置的电子装置

    公开(公告)号:US09074825B2

    公开(公告)日:2015-07-07

    申请号:US12239186

    申请日:2008-09-26

    IPC分类号: F28D15/02 G06F1/20 H01L23/427

    摘要: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

    摘要翻译: 散热装置通过循环工作流体并引起液相和气相之间的相变来进行冷却。 散热装置设置在具有发热体的外壁上。 散热装置包括将热量传递到受热板的箱形的热接收单元; 将工作流体供应到热接收单元的入口管; 排出蒸气的出口管,供给到受热板的工作流体通过加热而蒸发; 以及设置在高于所述受热单元的位置并散发通过所述出口管的蒸气的热量的散热器。 在由入口管的外周围被受热板的外侧包围的表面上的热接收板设置有狭缝。

    HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING SAME
    2.
    发明申请
    HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING SAME 审中-公开
    HEATSINK设备和具有相同功能的电子设备

    公开(公告)号:US20130063896A1

    公开(公告)日:2013-03-14

    申请号:US13587321

    申请日:2012-08-16

    IPC分类号: F28D15/02 H05K7/20

    摘要: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus includes a box-shaped heat receiver, provided with a heat-generating body on an external wall, to transfer heat to an internal wall. The heatsink apparatus includes an inlet pipe supplying the working fluid to the heat receiver, an outlet pipe discharging vapor, into which the working fluid supplied to the heat receiver is evaporated by heat, and a heat dissipater dissipating heat of the vapor passing through the outlet pipe. An opening portion of the inlet pipe is opposite to and near the internal wall so as cause the working fluid near the internal wall to flow.

    摘要翻译: 散热装置通过循环工作流体并引起液相和气相之间的相变来进行冷却。 散热装置包括在外壁上设置有发热体以将热量传递到内壁的箱形的热接收器。 散热装置包括将工作流体供应到热接收器的入口管,排出蒸气的出口管,供给到热接收器的工作流体通过热量蒸发到该出口管中;散热器散发通过出口的蒸气的热量 管。 入口管的开口部分与内壁相对并靠近内壁,从而使内壁附近的工作流体流动。

    HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME
    3.
    发明申请
    HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME 有权
    HEATSINK装置和具有该装置的电子装置

    公开(公告)号:US20090084525A1

    公开(公告)日:2009-04-02

    申请号:US12239186

    申请日:2008-09-26

    IPC分类号: F28D15/00 H05K7/20

    摘要: A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.

    摘要翻译: 散热装置通过循环工作流体并引起液相和气相之间的相变来进行冷却。 散热装置设置在具有发热体的外壁上。 散热装置包括将热量传递到受热板的箱形的热接收单元; 将工作流体供应到热接收单元的入口管; 排出蒸气的出口管,供给到受热板的工作流体通过加热而蒸发; 以及设置在高于所述受热单元的位置并散发通过所述出口管的蒸气的热量的散热器。 在由入口管的外周围被受热板的外侧包围的表面上的热接收板设置有狭缝。

    COOLING DEVICE FOR ELECTRONIC COMPONENTS
    4.
    发明申请
    COOLING DEVICE FOR ELECTRONIC COMPONENTS 审中-公开
    电子元件冷却装置

    公开(公告)号:US20070125526A1

    公开(公告)日:2007-06-07

    申请号:US11564531

    申请日:2006-11-29

    IPC分类号: H01L23/467 F24H3/02

    摘要: An inflow nozzle is disposed perpendicularly to plate-shaped fins of a heat-receiving section which is caused to face a heat-generating body to be cooled to draw heat therefrom, and portions of the plate-shaped fins are formed in a substantially V-shape or a substantially U-shape. Moreover, by selecting a proper dimension ratio of the thickness of a heat-receiving plate facing the heat-generating body and the length of the heat generating body, the heat absorption performance of the cooling device can be improved, and the cooling of the electronic component which generates high-temperature heat can be performed efficiently.

    摘要翻译: 流入喷嘴垂直于受热部分的板状散热片设置,该受热部分被面对要被冷却以产生热量的发热体,并且板状翅片的部分形成为大致V字形, 形状或大致U形。 此外,通过选择面向发热体的受热板的厚度与发热体的长度的合适的尺寸比,可以提高冷却装置的吸热性能,并且电子 可以有效地进行产生高温热的部件。