-
公开(公告)号：US20050193943A1
公开(公告)日：2005-09-08
申请号：US11120242
申请日：2005-05-02
申请人： Kaoru Shimbara , Masaharu Kimura , Yasuhiro Kurata , Takashi Hara
发明人： Kaoru Shimbara , Masaharu Kimura , Yasuhiro Kurata , Takashi Hara
IPC分类号： G11B23/50 , H01L21/687 , B05C11/02
CPC分类号： H01L21/68728 , G11B23/505 , H01L21/68785 , Y10S134/902
摘要： A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.
摘要翻译： 一种基板处理方法，用于通过在旋转基板的同时向基板供给处理液来处理基板。 该方法包括以下步骤：在通过第一夹持构件组夹持衬底的同时执行用于旋转衬底的第一衬底旋转过程; 在所述第一基板旋转步骤之后执行第二基板旋转过程，用于通过所述第一夹紧构件组夹住所述基板并且与所述第一夹紧构件组分开地设置的第二夹紧构件组来旋转所述基板; 以及在所述第二基板旋转步骤之后，通过由所述第二夹持部件夹持所述基板而使所述基板从所述第一夹紧部件组中松动以旋转所述基板而进行第三基板旋转处理。
-
公开(公告)号：US07241362B2
公开(公告)日：2007-07-10
申请号：US11120242
申请日：2005-05-02
申请人： Kaoru Shimbara , Masaharu Kimura , Takashi Hara
发明人： Kaoru Shimbara , Masaharu Kimura , Takashi Hara
CPC分类号： H01L21/68728 , G11B23/505 , H01L21/68785 , Y10S134/902
摘要： A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.
摘要翻译： 一种基板处理方法，用于通过在旋转基板的同时向基板供给处理液来处理基板。 该方法包括以下步骤：在通过第一夹持构件组夹持衬底的同时执行用于旋转衬底的第一衬底旋转过程; 在所述第一基板旋转步骤之后执行第二基板旋转过程，用于通过所述第一夹紧构件组夹住所述基板并且与所述第一夹紧构件组分开地设置的第二夹紧构件组来旋转所述基板; 以及在所述第二基板旋转步骤之后执行第三基板旋转处理，通过由所述第二夹紧构件组夹持所述基板，将所述基板从所述第一夹紧构件组中松动以旋转所述基板。
-
公开(公告)号：US20060113039A1
公开(公告)日：2006-06-01
申请号：US11332637
申请日：2006-01-13
申请人： Kaoru Shimbara , Masaharu Kimura , Takashi Hara
发明人： Kaoru Shimbara , Masaharu Kimura , Takashi Hara
IPC分类号： H01L21/306 , C23F1/00
CPC分类号： H01L21/68728 , G11B23/505 , H01L21/68785 , Y10S134/902
摘要： A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.
摘要翻译： 一种基板处理方法，用于通过在旋转基板的同时向基板供给处理液来处理基板。 该方法包括以下步骤：在通过第一夹持构件组夹持衬底的同时执行用于旋转衬底的第一衬底旋转过程; 在所述第一基板旋转步骤之后执行第二基板旋转过程，用于通过所述第一夹紧构件组夹住所述基板并且与所述第一夹紧构件组分开地设置的第二夹紧构件组来旋转所述基板; 以及在所述第二基板旋转步骤之后，通过由所述第二夹持部件夹持所述基板而使所述基板从所述第一夹紧部件组中松动以旋转所述基板而进行第三基板旋转处理。
-
公开(公告)号：US07018555B2
公开(公告)日：2006-03-28
申请号：US10623927
申请日：2003-07-21
申请人： Kaoru Shimbara , Masaharu Kimura , Yasuhiro Kurata , Takashi Hara
发明人： Kaoru Shimbara , Masaharu Kimura , Yasuhiro Kurata , Takashi Hara
CPC分类号： H01L21/68728 , G11B23/505 , H01L21/68785 , Y10S134/902
摘要： A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.
-
公开(公告)号：US07413628B2
公开(公告)日：2008-08-19
申请号：US11332637
申请日：2006-01-13
申请人： Kaoru Shimbara , Masaharu Kimura , Takashi Hara
发明人： Kaoru Shimbara , Masaharu Kimura , Takashi Hara
CPC分类号： H01L21/68728 , G11B23/505 , H01L21/68785 , Y10S134/902
摘要： A substrate treatment method for treating a substrate by supplying a treatment liquid to the substrate while rotating the substrate. The method comprises the steps of: performing a first substrate rotation process for rotating the substrate while clamping the substrate by a first clamping member set; performing a second substrate rotation process after the first substrate rotation step for rotating the substrate while clamping the substrate by the first clamping member set and a second clamping member set provided separately from the first clamping member set; and performing a third substrate rotation process after the second substrate rotation step by unclamping the substrate from the first clamping member set for rotating the substrate while clamping the substrate by the second clamping member set.
摘要翻译： 一种基板处理方法，用于通过在旋转基板的同时向基板供给处理液来处理基板。 该方法包括以下步骤：在通过第一夹持构件组夹持衬底的同时执行用于旋转衬底的第一衬底旋转过程; 在所述第一基板旋转步骤之后执行第二基板旋转过程，用于通过所述第一夹紧构件组夹住所述基板并且与所述第一夹紧构件组分开地设置的第二夹紧构件组来旋转所述基板; 以及在所述第二基板旋转步骤之后执行第三基板旋转处理，通过由所述第二夹紧构件组夹持所述基板，将所述基板从所述第一夹紧构件组中松动以旋转所述基板。
-
-
-
-
搜索结果
5 条记录 (耗时 0.016 秒)
