公开(公告)号：US07081214B2

公开(公告)日：2006-07-25

申请号：US10415004

申请日：2001-09-26

申请人： Yorishige Matsuba ,  Yoshihisa Misawa ,  Hideyuki Goto ,  Masayuki Ueda ,  Katsuhisa Oosako ,  Masaaki Oda ,  Norimichi Saito ,  Toshihiro Suzuki ,  Noriyuki Abe

发明人： Yorishige Matsuba ,  Yoshihisa Misawa ,  Hideyuki Goto ,  Masayuki Ueda ,  Katsuhisa Oosako ,  Masaaki Oda ,  Norimichi Saito ,  Toshihiro Suzuki ,  Noriyuki Abe

IPC分类号： C09D5/24 ,  C22C9/00 ,  H01B1/22 ,  H05K1/09 ,  B05D7/00

CPC分类号： B22F1/0062 ,  B22F2998/00 ,  C09J9/02 ,  H01B1/22 ,  H05K1/092 ,  Y10T428/29 ,  B22F1/0018

摘要： This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.5 to 20 μm, ultrafine metal particles having an average particle diameter of not larger than 100 nm, which are set in the state that the surfaces thereof are coated with one compound or more having a group comprising a nitrogen, oxygen, or sulfur atom and capable of coordinate-bonding by a lone pair existing in the atom, as a group capable of coordinate-bonding to a metal element contained in the ultrafine metal particles, and are dispersed uniformly in a resin composition comprising a heat curable resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvent; and thereby it enables low-temperature sintering of the ultrafine metal particles during a heat treatment at a low temperature.

摘要翻译： 本发明提供了一种用于高密度电路印刷的低温烧结导电浆料，其可以形成具有良好粘附力的细线，表面光滑，并且当施加在基底上时被烘烤; 本发明的导电性糊剂作为导电性介质，与平均粒径为0.5〜20μm的金属填充剂，平均粒径为100nm以下的超细金属粒子结合使用，其特征在于， 其表面涂覆有一种或多种具有包含氮原子，氧原子或硫原子并且能够通过存在于原子中的孤对对象配位的化合物作为能够与所含的金属元素配位的基团 在超细金属颗粒中均匀分散在包含热固性树脂组分，有机酸酐或其衍生物或有机酸的树脂组合物和一种或多种有机溶剂中; 从而能够在低温下的热处理中进行超微细金属粒子的低温烧结。