公开(公告)号：US20080073414A1

公开(公告)日：2008-03-27

申请号：US11860395

申请日：2007-09-24

申请人： Shun Saito ,  Katsumi Nakasato ,  Yukihiro Kato ,  Isao Nakata

发明人： Shun Saito ,  Katsumi Nakasato ,  Yukihiro Kato ,  Isao Nakata

IPC分类号： B23K31/02 ,  B23K1/00 ,  B23K35/363 ,  B23K1/08

CPC分类号： B23K1/008 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  H05K3/3484

摘要： Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.

摘要翻译： 提供焊剂助焊剂组合物，焊膏和使用其的焊接方法，其表现出优异的润湿性，提供高可靠性的焊点，并具有优良的储存稳定性。 助熔剂组合物含有至少一种具有至少一个选自羧酸化合物和乙烯基醚化合物反应得到的化合物（X）的封端羧基的化合物，通过羧酸酐反应获得的化合物（Y） 化合物和羟基乙烯基醚化合物，以及通过酸酐和多元醇反应获得的化合物（Z），然后用二乙烯基醚化合物进行加成聚合，并且助熔剂组合物不固化。

公开(公告)号：US07575150B2

公开(公告)日：2009-08-18

申请号：US11860395

申请日：2007-09-24

申请人： Shun Saito ,  Katsumi Nakasato ,  Yukihiro Kato ,  Isao Nakata

发明人： Shun Saito ,  Katsumi Nakasato ,  Yukihiro Kato ,  Isao Nakata

IPC分类号： B23K31/02

CPC分类号： B23K1/008 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  H05K3/3484

摘要： Soldering flux compositions, solder pastes, and methods of soldering using the same are provided, that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux composition is non-curing.

摘要翻译： 提供焊剂助焊剂组合物，焊膏和使用其的焊接方法，其表现出优异的润湿性，提供高可靠性的焊点，并具有优良的储存稳定性。 助熔剂组合物含有至少一种具有至少一个选自羧酸化合物和乙烯基醚化合物反应得到的化合物（X）的封端羧基的化合物，通过羧酸酐反应获得的化合物（Y） 化合物和羟基乙烯基醚化合物，以及通过酸酐和多元醇反应获得的化合物（Z），然后用二乙烯基醚化合物进行加成聚合，并且助熔剂组合物不固化。