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    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    1.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号：US20130084709A1

    公开(公告)日：2013-04-04

    申请号：US13628650

    申请日：2012-09-27

    申请人： Masahiro MIYAGI ,  Kazunori FUJIKAWA

    发明人： Masahiro MIYAGI ,  Kazunori FUJIKAWA

    IPC分类号： B08B3/08 ,  H01L21/465 ,  H01L21/306

    CPC分类号： H01L21/67028

    摘要： In a substrate processing apparatus, an anti-static liquid supply part supplies the anti-static liquid having electrical resistivity higher than that of an SPM liquid onto a substrate to puddle an entire upper surface of the substrate with the anti-static liquid, to thereby gradually remove static electricity from the substrate. Then, the processing liquid supply part supplies the SPM liquid onto the substrate to thereby perform an SPM process. In the SPM process, it is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and prevent any damage to the substrate. Further, by maintaining the electrical resistivity of the anti-static liquid at the target electrical resistivity, it is possible to increase the static elimination efficiency of the substrate and shorten the time required for the static elimination process within the limits of causing no damage to the substrate.

    摘要翻译： 在基板处理装置中，防静电液体供给部件将具有比SPM液体的电阻率高的抗静电液供给到基板上，从而将基板的整个上表面与防静电液体混合，由此 逐渐从基材中除去静电。 然后，处理液供给部将SPM液供给到基板上，由此进行SPM处理。 在SPM工艺中，可以防止大量电荷从基板迅速移动到SPM液体，并且防止对基板的任何损坏。 此外，通过将防静电液体的电阻率保持在目标电阻率，可以提高基板的静电消除效率，并且可以在不损害静电消除的限度内缩短静电消除处理所需的时间 基质。

    Substrate holder
    2.
    发明授权
    Substrate holder 失效
    基板支架

    公开(公告)号：US5704493A

    公开(公告)日：1998-01-06

    申请号：US578860

    申请日：1995-12-27

    申请人： Kazunori Fujikawa ,  Kenji Yasui ,  Hisao Nishizawa

    发明人： Kazunori Fujikawa ,  Kenji Yasui ,  Hisao Nishizawa

    IPC分类号： H01L21/673 ,  A47F7/00

    CPC分类号： H01L21/67313

    摘要： Semiconductor substrates are held by a substrate holder having a parallel arrangement of bridges, and are capable of being dipped in processing liquids by the holder. Each bridge has an alternate arrangement of teeth and valleys to define Y-shaped notches. Vent holes are formed in the bottoms of the notches for ready drainage of processing liquids. The substrates are held in the notches while contacting only the walls of the notches. Thus, there is minimum contact between the substrates and the substrate holder. When the holder is lifted up from the processing liquid, part of the processing liquid remaining around the contacts between the substrates and the valleys drain through the vent holes, which attributes to the rapid drying of the substrates.

    摘要翻译： 半导体衬底由具有平行布置的桥的衬底保持器保持，并且能够通过保持器浸入处理液体中。 每个桥梁具有齿和谷的交替布置，以限定Y形凹口。 在槽口的底部形成通气孔，以便处理液体就绪排放。 基板保持在凹口中，同时仅接触凹口的壁。 因此，基板和基板支架之间存在最小的接触。 当保持器从处理液体中提起时，残留在基板和谷之间的接触部分的处理液体的一部分通过通气孔排出，这些都是基板的快速干燥。

    Apparatus and method for rinsing and drying substrate
    3.
    发明授权
    Apparatus and method for rinsing and drying substrate 失效
    洗涤和干燥基材的装置和方法

    公开(公告)号：US5331987A

    公开(公告)日：1994-07-26

    申请号：US977067

    申请日：1992-11-16

    申请人： Eiichiro Hayashi ,  Kazunori Fujikawa

    发明人： Eiichiro Hayashi ,  Kazunori Fujikawa

    IPC分类号： H01L21/304 ,  B08B3/04 ,  H01L21/00 ,  B08B3/10

    CPC分类号： H01L21/67028 ,  B08B3/04 ,  Y10S134/902

    摘要： An apparatus for rinsing and drying a substrate includes a process chamber; a rinsing bath provided in the process chamber and having a first opening and a second opening at the bottom and at the upper portion, respectively; a device for supplying a rinsing solution into the rinsing bath through the first opening; a device for discharging the rinsing solution overflowing from the rinsing bath to the outside of the process chamber; a device for discharging the rinsing solution from the first opening of the rinsing bath; a device for elevating and lowering the substrate between positions above the rinsing bath and within the rinsing bath; a device for supplying predetermined ionized and heated gas, preferably, inactive gas such as nitrogen gas, into the process chamber; and a device for reducing pressure in the process chamber so as to dry the rinsed substrate. The apparatus optionally includes a device for heating the wall surface of the process chamber, and a device for removing the exhaust from the process chamber. Drying of the substrate is promoted by gas supplied into the process chamber when the substrate is pulled upward and out of the rinsing solution, and static electricity generated in the chamber is also electrically cancelled out by the gas, which, in turn, prevents adhesion of particles to the substrate.

    摘要翻译： 用于冲洗和干燥衬底的装置包括处理室; 设置在处理室中并且分别在底部和上部具有第一开口和第二开口的冲洗槽; 用于通过所述第一开口将漂洗溶液供应到所述漂洗槽中的装置; 用于将从冲洗槽溢出的冲洗溶液排出到处理室外部的装置; 用于从冲洗浴的第一开口排出冲洗溶液的装置; 一种用于在冲洗槽上方和冲洗槽之间的位置之间升高和降低基板的装置; 用于将预定的电离和加热气体，优选地，诸如氮气的惰性气体供应到处理室中的装置; 以及用于降低处理室中的压力以便干燥漂洗的基底的装置。 该装置可选地包括用于加热处理室的壁表面的装置和用于从处理室移除排气的装置。 当衬底向上拉出冲洗溶液时，通过供应到处理室中的气体促进衬底的干燥，并且在室中产生的静电也被气体电气抵消，这反过来又防止了粘附 颗粒到基底。

    Substrate processing apparatus and substrate processing method
    5.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号：US09142433B2

    公开(公告)日：2015-09-22

    申请号：US13628650

    申请日：2012-09-27

    申请人： Masahiro Miyagi ,  Kazunori Fujikawa

    发明人： Masahiro Miyagi ,  Kazunori Fujikawa

    IPC分类号： H01L21/306 ,  H01L21/302 ,  B08B3/08 ,  H01L21/67

    CPC分类号： H01L21/67028

    摘要： In a substrate processing apparatus, an anti-static liquid supply part supplies the anti-static liquid having electrical resistivity higher than that of an SPM liquid onto a substrate to puddle an entire upper surface of the substrate with the anti-static liquid, to thereby gradually remove static electricity from the substrate. Then, the processing liquid supply part supplies the SPM liquid onto the substrate to thereby perform an SPM process. In the SPM process, it is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and prevent any damage to the substrate. Further, by maintaining the electrical resistivity of the anti-static liquid at the target electrical resistivity, it is possible to increase the static elimination efficiency of the substrate and shorten the time required for the static elimination process within the limits of causing no damage to the substrate.

    摘要翻译： 在基板处理装置中，防静电液体供给部件将具有比SPM液体的电阻率高的抗静电液供给到基板上，从而将基板的整个上表面与防静电液体混合，由此 逐渐从基材中除去静电。 然后，处理液供给部将SPM液供给到基板上，由此进行SPM处理。 在SPM工艺中，可以防止大量电荷从基板迅速移动到SPM液体，并且防止对基板的任何损坏。 此外，通过将防静电液体的电阻率保持在目标电阻率，可以提高基板的静电消除效率，并且可以在不损害静电消除的限度内缩短静电消除处理所需的时间 基质。