公开(公告)号：US20100083583A1

公开(公告)日：2010-04-08

申请号：US12523543

申请日：2008-01-18

申请人： Hitoshi Sumiya ,  Kazushi Obata ,  Miki Yoshinaga

发明人： Hitoshi Sumiya ,  Kazushi Obata ,  Miki Yoshinaga

IPC分类号： B23B27/20 ,  B23B27/14 ,  C01B31/06

CPC分类号： B01J3/062 ,  B01J2203/061 ,  B01J2203/062 ,  B01J2203/0655 ,  B01J2203/068 ,  B01J2203/0685 ,  B23B27/20 ,  B23B2226/315 ,  B82Y30/00 ,  C01B32/25 ,  C01P2002/60 ,  C04B35/52 ,  C04B35/645 ,  C04B2235/422 ,  C04B2235/425 ,  C04B2235/427 ,  C04B2235/5288 ,  C04B2235/5292 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/656 ,  C04B2235/781 ,  C04B2235/783 ,  C04B2235/785 ,  C04B2235/96 ,  C04B2235/963

摘要： One object of the present invention is to provide a cutting tool excellent in strength and wear resistance. The cutting tool has a cutting blade formed using a highly hard diamond polycrystalline body made substantially only of diamond and produced by directly converting a raw material composition including a non-diamond type carbon material into diamond and sintering the diamond at an ultra high pressure and an ultra high temperature without adding a sintering aid or a catalyst, the polycrystalline body having a mixed construction including fine-grained diamond crystals with a maximum grain size of less than or equal to 100 nm and an average grain size of less than or equal to 50 nm and plate-like or particulate coarse-grained diamond crystals with a minimum grain size of greater than or equal to 50 nm and a maximum grain size of less than or equal to 10000 nm.

摘要翻译： 本发明的一个目的是提供一种强度和耐磨性优异的切削工具。 切割工具具有使用基本上仅由金刚石制成的高硬度金刚石多晶体形成的切割刀片，其通过将包含非金刚石型碳材料的原料组合物直接转化为金刚石并以超高压烧结金刚石， 超高温而不添加烧结助剂或催化剂，所述多晶体具有混合结构，所述混合结构包括最大粒度小于或等于100nm的细晶粒金刚石晶体和平均晶粒尺寸小于或等于50 nm和具有大于或等于50nm的最小晶粒尺寸和小于或等于10000nm的最大晶粒尺寸的板状或颗粒状粗粒金刚石晶体。

公开(公告)号：US07556456B2

公开(公告)日：2009-07-07

申请号：US10571605

申请日：2005-06-15

申请人： Miki Yoshinaga ,  Kazushi Obata

发明人： Miki Yoshinaga ,  Kazushi Obata

IPC分类号： B23B27/20 ,  B23B27/22

CPC分类号： B23B27/20 ,  B23B2200/245 ,  B23B2226/31 ,  B23B2240/08 ,  B23C2200/203 ,  B23C2200/243 ,  B23C2200/246 ,  B23C2200/283 ,  Y10T407/235 ,  Y10T407/26 ,  Y10T407/27

摘要： A mono crystalline diamond cutting tool is provided which can perform ultra precision machining on a crystalline material or a hard and brittle material with good swarf discharge and reduced cutting resistance to improve a precision of a cut surface, and has less wear or microchipping of a cutting edge and thus achieves long life. A tip having a cutting edge ridge in a rounded shape at a front end is provided, and a portion of the cutting edge ridge serving at least as a cutting edge is formed to have constant roundness by intersecting a first conical surface as a rake face with a second conical surface as a flank. The cutting edge ridge is rounded with a radius of less than 100 nm, the first conical surface has a width of 1 to 5 μm, and a swarf release face substantially perpendicular to a cutting direction is provided in a portion on a side of the first conical surface opposite a line of the cutting edge ridge. An intersection of the first conical surface and the swarf release face has a rounded face with a radius of 0.1 to 1.0 μm. The first conical surface has a negative rake angle of 15° to 50°.

摘要翻译： 提供了一种单晶金刚石切割工具，其可以在结晶材料或硬脆材料上进行超精密加工，具有良好的切屑排放和降低的切割阻力，以提高切割表面的精度，并且具有较少的切割磨损或微切削 从而达到长寿命。 提供具有在前端具有圆形形状的切割边缘的尖端，并且至少用作切削刃的切削刃脊的一部分通过将作为前刀面的第一圆锥形表面与 作为侧面的第二锥形表面。 切割刃脊以小于100nm的半径圆化，第一圆锥面的宽度为1〜5μm，在切割方向上大致垂直的切屑剥离面设置在第一 锥形表面与切割边缘脊线相对。 第一锥形表面和切屑释放面的交点具有半径为0.1至1.0μm的圆形面。 第一锥形表面具有15°至50°的负前角。

公开(公告)号：US20080253849A1

公开(公告)日：2008-10-16

申请号：US10571605

申请日：2005-06-15

申请人： Miki Yoshinaga ,  Kazushi Obata

发明人： Miki Yoshinaga ,  Kazushi Obata

IPC分类号： B23B27/20

CPC分类号： B23B27/20 ,  B23B2200/245 ,  B23B2226/31 ,  B23B2240/08 ,  B23C2200/203 ,  B23C2200/243 ,  B23C2200/246 ,  B23C2200/283 ,  Y10T407/235 ,  Y10T407/26 ,  Y10T407/27

摘要： A mono crystalline diamond cutting tool is provided which can perform ultra precision machining on a crystalline material or a hard and brittle material with good swarf discharge and reduced cutting resistance to improve a precision of a cut surface, and has less wear or microchipping of a cutting edge and thus achieves long life. A tip having a cutting edge ridge in a rounded shape at a front end is provided, and a portion of the cutting edge ridge serving at least as a cutting edge is formed to have constant roundness by intersecting a first conical surface as a rake face with a second conical surface as a flank. The cutting edge ridge is rounded with a radius of less than 100 nm, the first conical surface has a width of 1 to 5 μm, and a swarf release face substantially perpendicular to a cutting direction is provided in a portion on a side of the first conical surface opposite a line of the cutting edge ridge. An intersection of the first conical surface and the swarf release face has a rounded face with a radius of 0.1 to 1.0 μm. The first conical surface has a negative rake angle of 15° to 50°.

摘要翻译： 提供了一种单晶金刚石切割工具，其可以在结晶材料或硬脆材料上进行超精密加工，具有良好的切屑排放和降低的切割阻力，以提高切割表面的精度，并且具有较少的切割磨损或微切削 从而达到长寿命。 提供具有在前端具有圆形形状的切割边缘的尖端，并且至少用作切削刃的切削刃脊的一部分通过将作为前刀面的第一圆锥形表面与 作为侧面的第二锥形表面。 切割刃脊以小于100nm的半径圆化，第一圆锥面的宽度为1〜5μm，在切割方向上大致垂直的切屑剥离面设置在第一 锥形表面与切割边缘脊线相对。 第一锥形表面和切屑释放面的交点具有半径为0.1至1.0μm的圆形面。 第一锥形表面具有15°至50°的负前角。