公开(公告)号：US20050277282A1

公开(公告)日：2005-12-15

申请号：US11135350

申请日：2005-05-24

申请人： Yasuyoshi Horikawa ,  Keiichi Takemoto

发明人： Yasuyoshi Horikawa ,  Keiichi Takemoto

IPC分类号： H05K3/40 ,  H01L29/40

CPC分类号： H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10242 ,  H05K2201/10416

摘要： A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.

摘要翻译： 本发明的布线基板的制造方法包括：准备含有半固化树脂层或热塑性树脂层的基板的步骤，形成贯通基板的通孔的工序， 通孔中的导电部分，在通过向基板施加热压力使树脂层流动的状态下固化半树脂层或热塑性树脂层的步骤，并填充通孔之间的间隙 和具有树脂层的导电部件，以及在基板的两个表面侧上形成经由导电部件相互连接的布线图案的步骤。

公开(公告)号：US07276438B2

公开(公告)日：2007-10-02

申请号：US11135350

申请日：2005-05-24

申请人： Yasuyoshi Horikawa ,  Keiichi Takemoto

发明人： Yasuyoshi Horikawa ,  Keiichi Takemoto

IPC分类号： H01L29/06

CPC分类号： H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10242 ,  H05K2201/10416

摘要： A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.

摘要翻译： 本发明的布线基板的制造方法包括：准备含有半固化树脂层或热塑性树脂层的基板的步骤，形成贯通基板的通孔的工序， 通孔中的导电部分，在通过向基板施加热压力使树脂层流动的状态下固化半树脂层或热塑性树脂层的步骤，并填充通孔之间的间隙 和具有树脂层的导电部件，以及在基板的两个表面侧上形成经由导电部件相互连接的布线图案的步骤。