公开(公告)号：US20180241285A1

公开(公告)日：2018-08-23

申请号：US15441123

申请日：2017-02-23

申请人： Schaft Inc.

发明人： Akihiko Sasaki ,  Nobuyuki Ito ,  Junichi Urata

IPC分类号： H02K9/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K1/09 ,  H02K11/33

CPC分类号： H02K9/005 ,  H02K11/33 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/09 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10416

摘要： A system includes a primary Printed Circuit Board (PCB) and a heat transfer device that is attached to the primary PCB. The primary PCB includes a heat generating device and a thermal conductive inlay attached to the heat generating device. The heat transfer device includes a secondary PCB that is thermally coupled to the primary PCB, and a heat dissipation block. The heat dissipation block has a first side attached to the thermal conductive inlay of the primary PCB and a second side attached to the secondary PCB.

公开(公告)号：US20180233429A1

公开(公告)日：2018-08-16

申请号：US15952279

申请日：2018-04-13

申请人： Murata Manufacturing Co., Ltd.

发明人： Kuniaki YOSUI ,  Takahiro BABA ,  Yoshiyuki MASHIMO

IPC分类号： H01L23/367 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L23/3675 ,  H01L23/12 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/19 ,  H01L2224/2402 ,  H01L2224/24141 ,  H01L2224/24265 ,  H01L2224/25171 ,  H01L2224/32057 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33051 ,  H01L2224/33519 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/141 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4632 ,  H05K3/4697 ,  H05K2201/10416

摘要： A multilayer board includes a base including insulating layers stacked in a stacking direction, and a mounting surface at an end of the base in a first direction along the stacking direction, an electronic component inside the base, and a first heat dissipator extending through at least one of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction to the mounting surface. When a section of the first heat dissipator is defined as a first section, and a section of the first heat dissipator located farther in a second direction along the layer stacking direction than the first section is defined as a second section, there is a combination of a first section and a second section in which the second section extends farther outward than the first section when viewed from the layer stacking direction.

公开(公告)号：US20180206324A1

公开(公告)日：2018-07-19

申请号：US15743323

申请日：2016-06-14

申请人： NEC CORPORATION

发明人： Makoto HAYAKAWA

IPC分类号： H05K1/02 ,  H01L23/12 ,  H01L23/373 ,  H04B1/38 ,  H05K7/20

CPC分类号： H05K1/0204 ,  H01L23/12 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H04B1/38 ,  H05K1/021 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/368 ,  H05K7/20 ,  H05K7/2049 ,  H05K2201/049 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10416

摘要： Provided is a mounting structure that can bond a first heat dissipation element to a second substrate through a hole in a first substrate without using a binder such as solder, an adhesive, or the like. A mounting structure of the present disclosure includes a first substrate (10) in which a penetrating hole (11) is formed, a second substrate (20) and a first heat dissipation element (30) overlapped with both surfaces of the first substrate (10), respectively, so as to cover the penetrating hole (11), and a second heat dissipation element (40) sandwiched and attached between the second substrate (20) and the first heat dissipation element (30) inside the penetrating hole (11).

公开(公告)号：US09978505B2

公开(公告)日：2018-05-22

申请号：US14777399

申请日：2014-03-10

申请人： OMRON AUTOMOTIVE ELECTRONICS CO., LTD.

发明人： Koji Hachiya ,  Tomoyoshi Kobayashi ,  Koichi Nakabayashi

IPC分类号： H01F27/08 ,  H01F27/02 ,  H01F27/28 ,  H01F27/22 ,  H01F37/00 ,  H05K1/16 ,  H05K1/02 ,  H05K3/00

CPC分类号： H01F27/2876 ,  H01F27/22 ,  H01F27/2804 ,  H01F37/00 ,  H01F2027/2819 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/165 ,  H05K3/0061 ,  H05K2201/086 ,  H05K2201/10409 ,  H05K2201/10416

摘要： A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.

公开(公告)号：US20180132348A1

公开(公告)日：2018-05-10

申请号：US15803527

申请日：2017-11-03

申请人： Flex Ltd.

发明人： JH Berkel ,  Todd Robinson ,  Joan K. Vrtis

IPC分类号： H05K1/02 ,  H05K3/02 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K1/021 ,  H05K3/0061 ,  H05K3/022 ,  H05K3/4611 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10416

摘要： A metal pallet is integrated within a circuit board using a process similar to a multilayer PCB, which integrates the metal pallet into the circuit board at the same time as the supporting layers are fabricated. The use of B-stage material provides a bonding mechanism for the metal pallet to be embedded within the circuit board, creating a cohesive integrated part. Embedding the pallet during the fabrication process, pre-lamination, generates a more robust construction and connection not impacted by post fabrication process in assembly. After assembly the circuit board with embedded metal pallet can be mounted directly on a heat sink, cool ribbon or other feature required to help remove heat. The planar back side surface provides a more robust mounting of the metal pallet than a post fabricated assembly as used in conventional techniques.

公开(公告)号：US20180035531A1

公开(公告)日：2018-02-01

申请号：US15224406

申请日：2016-07-29

申请人： Ravi Kiran Nalla ,  Raymond Kirk Price

发明人： Ravi Kiran Nalla ,  Raymond Kirk Price

IPC分类号： H05K1/02 ,  G02B6/42 ,  H05K3/46 ,  H05K1/18 ,  H05K3/32

CPC分类号： H05K1/0206 ,  G02B6/4267 ,  G02B6/428 ,  G02B6/4283 ,  H05K1/0204 ,  H05K1/0274 ,  H05K1/183 ,  H05K3/32 ,  H05K3/4697 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10416 ,  H05K2201/2054

摘要： This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance.

公开(公告)号：US09832856B2

公开(公告)日：2017-11-28

申请号：US15002720

申请日：2016-01-21

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Tae-Hong Min ,  Myung-Sam Kang ,  Young-Gwan Ko

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K1/0204 ,  H05K1/0207 ,  H05K1/0218 ,  H05K1/0271 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/066 ,  H05K2201/10416

摘要： Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer body disposed in the insulating part, the heat-transfer body including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer body between a top surface and a bottom surface of the heat-transfer body.

公开(公告)号：US09781840B2

公开(公告)日：2017-10-03

申请号：US14938191

申请日：2015-11-11

申请人： IBIDEN CO., LTD.

发明人： Naoyuki Nagaya ,  Kiyotaka Tsukada

IPC分类号： H05K1/03 ,  H05K3/34 ,  H05K1/02 ,  H05K3/00

CPC分类号： H05K3/341 ,  H05K1/0206 ,  H05K3/005 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y02P70/613

摘要： A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.

公开(公告)号：US09775237B2

公开(公告)日：2017-09-26

申请号：US15153884

申请日：2016-05-13

申请人： IBIDEN CO., LTD.

发明人： Kosuke Ikeda

IPC分类号： H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/46 ,  H05K3/40

CPC分类号： H05K1/0298 ,  H05K1/0204 ,  H05K1/0373 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4038 ,  H05K3/4652 ,  H05K3/4661 ,  H05K3/4673 ,  H05K3/4697 ,  H05K2201/0183 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/10416

摘要： A wiring substrate includes a core substrate, and a build-up layer including conductor layers and insulating layers alternately laminated on the substrate and via conductors formed in the insulating layers, each insulating layer having a coating layer and a support layer stacked on the coating layer such that the support layer has surface on which a conductor layer is laminated and the coating layer is covering a conductor layer, each via conductor connecting two conductor layers through an insulating layer. The coating layer has a thickness greater than that of the support layer and includes inorganic filler at content rate of 65 to 85% by mass, and the support layer includes inorganic filler at different content rate such that thermal expansion coefficient of the coating layer is smaller than that of the support layer and the coefficients of the coating and support layers have difference of 30 ppm/° C. or less.

公开(公告)号：US09699901B2

公开(公告)日：2017-07-04

申请号：US14016398

申请日：2013-09-03

申请人： Huawei Technologies Co., Ltd.

发明人： Kai Yao ,  Yongfa Zhu ,  Yingpei Huang

IPC分类号： H05K5/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC分类号： H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

摘要： A golden finger and a board edge interconnecting device are disclosed. The golden finger includes a printed circuit board (PCB) surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.