公开(公告)号：US20120247645A1

公开(公告)日：2012-10-04

申请号：US13504356

申请日：2010-11-30

申请人： Keiichiro Tsutsumi ,  Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Takenori Suzuki ,  Kensuke Ide

发明人： Keiichiro Tsutsumi ,  Takeshi Tsuno ,  Takayuki Goto ,  Masato Kinouchi ,  Takenori Suzuki ,  Kensuke Ide

IPC分类号： B32B41/00 ,  B32B37/08 ,  B32B37/06

CPC分类号： H01L21/67092 ,  H01L21/187

摘要： The present invention includes an activating step S2 of activating, by irradiating a first substrate surface of a first substrate and a second substrate surface of a second substrate with particles, the second substrate surface and the first substrate surface, and a bonding step S4 of bonding the second substrate and the first substrate together by bringing the second substrate surface and the first substrate surface into contact with each other after a temperature difference between a temperature of the first substrate and a temperature of the second substrate becomes equal to or lower than a predetermined value. According to this bonding method, warpage occurring in a bonded substrate obtained can be further reduced compared with other bonding methods of bonding both substrates before the temperature difference between the temperature of the first substrate and the temperature of the second substrate becomes equal to or lower than a predetermined value.

摘要翻译： 本发明包括激活步骤S2，通过用第二基板表面和第一基板表面照射第一基板的第一基板表面和第二基板的第二基板表面，以及接合步骤S4 第二基板和第一基板通过使第二基板表面和第一基板表面在第一基板的温度和第二基板的温度之间的温度差等于或低于预定的温度之间彼此接触而一起 值。 根据该接合方法，与在第一基板的温度和第二基板的温度之间的温度差变为等于或低于第一基板的温度差之前的两个基板的其他接合方法相比，获得的接合基板的翘曲可以进一步降低 预定值。