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公开(公告)号:US06946034B1
公开(公告)日:2005-09-20
申请号:US10643262
申请日:2003-08-19
申请人: Robert William Bruce , Antonio Frank Maricocchi , Christopher Lee Lagemann , John Douglas Evans, Sr. , Keith Humphries Betscher , Rudolfo Viguie , David Vincent Rigney , David John Wortman , William Seth Willen
发明人: Robert William Bruce , Antonio Frank Maricocchi , Christopher Lee Lagemann , John Douglas Evans, Sr. , Keith Humphries Betscher , Rudolfo Viguie , David Vincent Rigney , David John Wortman , William Seth Willen
CPC分类号: C23C14/52 , C23C14/246 , C23C14/30 , C23C14/541 , C23C14/56 , H01J37/3053
摘要: An electron beam physical vapor deposition (EBPVD) apparatus for producing a coating material (e.g., a ceramic thermal barrier coating) on an article. The EBPVD apparatus generally includes a coating chamber that is operable at elevated temperatures and subatmospheric pressures. An electron beam gun projects an electron beam into the coating chamber through an aperture in a wall of the chamber and onto a coating material within a coating region defined within the chamber, causing the coating material to melt and evaporate. An article is supported within the coating chamber so that vapors of the coating material deposit on the article. The operation of the EBPVD apparatus is enhanced by the inclusion within the coating chamber of a second chamber that encloses the aperture so as to separate the aperture from the coating region. The second chamber is maintained at a pressure lower than the coating region.
摘要翻译: 一种用于在制品上生产涂层材料(例如,陶瓷热障涂层)的电子束物理气相沉积(EBPVD)装置。 EBPVD设备通常包括可在升高的温度和低于大气压的压力下操作的涂覆室。 电子束枪将电子束通过腔室的孔中的电子束投射到涂覆室中,并且覆盖在腔室内限定的涂层区域内的涂层材料上,导致涂层材料熔化和蒸发。 在涂层室内支撑制品,使得涂层材料的蒸气沉积在制品上。 EBPVD装置的操作通过包围在包围孔的第二腔室的涂覆室内以便将孔与涂覆区域分开来增强。 第二室保持在比涂覆区域低的压力。
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2.
公开(公告)号:US06863937B2
公开(公告)日:2005-03-08
申请号:US10299646
申请日:2002-11-19
申请人: Robert William Bruce , Antonio Frank Maricocchi , Christopher Lee Lagemann , John Douglas Evans, Sr. , Keith Humphries Betscher , Rudolfo Viguie , David Vincent Rigney , David John Wortman , William Seth Willen
发明人: Robert William Bruce , Antonio Frank Maricocchi , Christopher Lee Lagemann , John Douglas Evans, Sr. , Keith Humphries Betscher , Rudolfo Viguie , David Vincent Rigney , David John Wortman , William Seth Willen
CPC分类号: C23C14/246 , C23C14/30 , C23C14/52 , C23C14/541 , C23C14/56 , H01J37/3053 , H01J2237/3132
摘要: An electron beam physical vapor deposition (EBPVD) apparatus and a method for using the apparatus to produce a coating material (e.g., a ceramic thermal barrier coating) on an article. The EBPVD apparatus generally includes a coating chamber that is operable at elevated temperatures and subatmospheric pressures. An electron beam gun projects an electron beam into the coating chamber and onto a coating material within the chamber, causing the coating material to melt and evaporate. An article is supported within the coating chamber so that vapors of the coating material deposit on the article. The operation of the EBPVD apparatus is enhanced by the inclusion or adaptation of one or more mechanical and/or process modifications, including those necessary or beneficial when operating the apparatus at coating pressures above 0.010 mbar.
摘要翻译: 电子束物理气相沉积(EBPVD)装置和使用该装置在制品上制备涂层材料(例如,陶瓷热障涂层)的方法。 EBPVD设备通常包括可在升高的温度和低于大气压的压力下操作的涂覆室。 电子束枪将电子束投射到涂层室中并且涂覆在腔室内的涂层材料上,导致涂层材料熔化和蒸发。 在涂层室内支撑制品,使得涂层材料的蒸气沉积在制品上。 EBPVD装置的操作通过包含或适应一种或多种机械和/或工艺改进而得到增强,包括在涂覆压力高于0.010mbar的条件下操作设备时必需或有益的修改。
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