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公开(公告)号：US08786034B2
公开(公告)日：2014-07-22
申请号：US13608022
申请日：2012-09-10
IPC分类号： H01L29/84
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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公开(公告)号：US6020424A
公开(公告)日：2000-02-01
申请号：US884829
申请日：1997-06-30
申请人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
发明人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
IPC分类号： C08K3/00 , C09D183/04
CPC分类号： C08K3/0033 , C09D183/04
摘要： The present invention provides a screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.
摘要翻译： 本发明提供一种用于形成导热界面的可丝网印刷热固性组合物及其使用方法。 该组合物用于促进热从诸如电子装置的热量到诸如散热器的散热装置的传热。 组合物包含约35％至约75％的热固化乙烯基封端的硅氧烷材料，约0.005％至约5％的催化剂，约10％至约30％的烃溶剂和约20％至约70％ ％导电填料。
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公开(公告)号：US06204303B1
公开(公告)日：2001-03-20
申请号：US09408568
申请日：1999-09-28
申请人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
发明人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
IPC分类号： C08F248
CPC分类号： C09D11/101 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0.5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.
摘要翻译： 本发明提供了一种用于形成导热界面的新型可UV固化组合物及其使用方法。 该组合物用于促进热从诸如电子装置的热量到诸如散热器的散热装置的传热。 该组合物包含约35％至约75％的UV可固化丙烯酸酯材料，约0.5％至约15％的催化剂，约10％至约30％的烃溶剂和约20％至约70％的导电性 填料。
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4.发明申请公开(公告)号：US20110169108A1
公开(公告)日：2011-07-14
申请号：US12532424
申请日：2009-07-15
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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公开(公告)号：US5968606A
公开(公告)日：1999-10-19
申请号：US884995
申请日：1997-06-30
申请人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
发明人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
CPC分类号： C09D11/101 , H01L23/3737 , H01L2924/0002
摘要： The present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0.5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.
摘要翻译： 本发明提供了一种用于形成导热界面的新型可UV固化组合物及其使用方法。 该组合物用于促进热从诸如电子装置的热量到诸如散热器的散热装置的传热。 该组合物包含约35％至约75％的UV可固化丙烯酸酯材料，约0.5％至约15％的催化剂，约10％至约30％的烃溶剂和约20％至约70％的导电性 填料。
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6.发明授权公开(公告)号：US08307674B2
公开(公告)日：2012-11-13
申请号：US12532424
申请日：2009-07-15
IPC分类号： C03C27/00
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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公开(公告)号：US20130062712A1
公开(公告)日：2013-03-14
申请号：US13608022
申请日：2012-09-10
CPC分类号： C03C8/24 , C03C3/066 , C03C3/072 , C03C3/16 , C03C8/245 , H01L2224/48091 , H01L2224/48465 , H01L2924/16235 , H01L2924/00014
摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。
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公开(公告)号：US06210520B1
公开(公告)日：2001-04-03
申请号：US09399546
申请日：1999-09-22
申请人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
发明人： Jesus E. Osuna , Keith M. Mason , Vernon E. Stygar
IPC分类号： C09J900
CPC分类号： C09D183/04 , C08K3/013 , C08L2666/28 , C08L2666/54 , C08L83/04
摘要： The present invention provides a novel screen printable thermosetting composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a thermal curing vinyl terminated siloxane material, from about 0.005% to about 5% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.
摘要翻译： 本发明提供了一种用于形成导热界面的新型丝网印刷热固性组合物及其使用方法。 该组合物用于促进热从诸如电子装置的热量到诸如散热器的散热装置的传热。 组合物包含约35％至约75％的热固化乙烯基封端的硅氧烷材料，约0.005％至约5％的催化剂，约10％至约30％的烃溶剂和约20％至约70％ ％导电填料。
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