摘要:
A trench is formed on a semiconductor substrate with a first insulation film patterned on the semiconductor substrate as a mask; a second insulation film is embedded in the trench and flattened; an upper portion of the first insulation film is selectively removed, and a part of a side face of the second insulation film is exposed; a part of the second insulation film is isotropically removed; a lower portion of the remaining first insulation film is selectively removed; and then a part of the remaining second insulation film is further isotropically removed so that an upper face of the second insulation film is at a predetermined height from a surface of the semiconductor substrate, a taper having a minimum taper angle of 90° or more is formed on the side face of the second insulation film, and a STI is formed.
摘要:
A terminal for telegraph and telephone systems using as an overvoltage/overcurrent protecting component a positive temperature coefficient thermistor element comprising a plate-shaped ceramic body made of a ceramic material whose Curie temperature is in the range of 60.degree. to 120.degree. C., and having a thickness of 2.5 to 5.0 mm, and electrodes formed on both major surfaces of the ceramic body.
摘要:
A method of supplying positive temperature coefficient thermistor elements in which a plurality of positive temperature coefficient thermistor elements 1 are divided into groups G.sub.1 to G.sub.8 for each range of predetermined resistance values, two arbitrary positive temperature coefficient thermistor elements are taken out of one of the groups G.sub.1 to G.sub.8 and supplied as one set of positive temperature coefficient thermistor elements.
摘要:
A trench is formed on a semiconductor substrate with a first insulation film patterned on the semiconductor substrate as a mask; a second insulation film is embedded in the trench and flattened; an upper portion of the first insulation film is selectively removed, and a part of a side face of the second insulation film is exposed; a part of the second insulation film is isotropically removed; a lower portion of the remaining first insulation film is selectively removed; and then a part of the remaining second insulation film is further isotropically removed so that an upper face of the second insulation film is at a predetermined height from a surface of the semiconductor substrate, a taper having a minimum taper angle of 90° or more is formed on the side face of the second insulation film, and a STI is formed.
摘要:
A trench is formed on a semiconductor substrate with a first insulation film patterned on the semiconductor substrate as a mask; a second insulation film is embedded in the trench and flattened; an upper portion of the first insulation film is selectively removed, and a part of a side face of the second insulation film is exposed; a part of the second insulation film is isotropically removed; a lower portion of the remaining first insulation film is selectively removed; and then a part of the remaining second insulation film is further isotropically removed so that an upper face of the second insulation film is at a predetermined height from a surface of the semiconductor substrate, a taper having a minimum taper angle of 90° or more is formed on the side face of the second insulation film, and a STI is formed.
摘要:
A positive temperature coefficient thermistor element comprising a plate-shaped ceramic body made of a ceramic material whose Curie temperature is in the range of 60.degree. to 120.degree. C., and having a thickness of 2.5 to 5.0 mm, and electrodes formed on both major surfaces of the ceramic body.