公开(公告)号：US4639631A

公开(公告)日：1987-01-27

申请号：US750455

申请日：1985-07-01

申请人： Marc K. Chason ,  Carl A. Kotecki ,  Joseph P. Tomase ,  Michael J. Onystok ,  Donald J. Ryback ,  Robert G. Kinsman ,  Lawrence N. Dworsky ,  Kenneth J. Nield ,  Steven C. Moore

发明人： Marc K. Chason ,  Carl A. Kotecki ,  Joseph P. Tomase ,  Michael J. Onystok ,  Donald J. Ryback ,  Robert G. Kinsman ,  Lawrence N. Dworsky ,  Kenneth J. Nield ,  Steven C. Moore

IPC分类号： H03H9/02 ,  H01L41/053 ,  H03H9/10 ,  H01L41/08

CPC分类号： H03H9/1014 ,  H03H9/1021

摘要： A piezoelectric device package consists of a base and a cover which are sealed together to hermetically seal a piezoelectric device such as a quartz crystal therebetween. A recess in the cover receives the quartz crystal. Feedthrough holes in the base, or the cover, or both, which have electrostatic seals formed over them provide a means for making electrical connections with the quartz wafer while still maintaining the hermetic seal.

摘要翻译： 一种压电器件封装由基底和盖子组成，它们密封在一起以密封其间的石英晶体等压电器件。 盖中的凹槽接收石英晶体。 底部或盖子中的穿通孔，其上形成有静电密封件，提供了与石英晶片进行电连接同时仍然保持气密密封的装置。