摘要:
A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to a trace at a test access point and above an exposed surface of the printed circuit board to be accessible for probing by a fixture probe. The test access point structure may be designed and manufactured to permit deformation of the test access point structure upon initial probing of the test access point structure with a fixture probe to ensure electrical contact between the fixture probe and the test access point structure.
摘要:
Disclosed herein are various methods and apparatus related to Boundary-Scan testing, including a method for generating Boundary-Scan test vectors. The method assigns different binary signatures to all of the drivers and hysteretic test receiver memories of a circuit assembly under test, and then generates a series of Boundary-Scan test vectors wherein each test vector is derived from corresponding bits of the binary signatures.
摘要:
A method and apparatus for detecting open defects on non-probed node under test of an electrical device using capacitive lead frame technology is presented. In accordance with the method of the invention, a probed node neighboring the non-probed node under test is stimulated with a known source signal. A sensor of a capacitive sensing probe is capacitively coupled to at least the probed node and non-probed node under test of the electrical device, and a measuring device coupled to the capacitive sensing probe measures a capacitively coupled signal present between the sensor of the probe and at least the probed and non-probed node of the electrical device. Based on the value of the capacitively sensed signal, a known expected “defect-free” capacitively sensed signal measurement and/or a known expected “open” capacitively sensed signal measurement, a determination is made of whether an open defect exists on the non-probed node under test of the electrical device.
摘要:
Techniques for automating test pad insertion in a printed circuit board (PCB) design and fixture probe insertion in a PCB tester fixture are presented. A probe location algorithm predictably determines respective preferred probing locations from among respective sets of potential probing locations associated with a number of respective nets in a PCB design. Test pads, preferably in the form of bead probes, are added to the PCB design at the respective preferred probing locations along with, where feasible, one or more alternate probing locations chosen from among remaining ones of the respective sets of potential probing locations. During fixture design, nets with multiple test pads implemented in the PCB design are processed by the same probe location algorithm used during PCB design to determine the associated preferred and alternate probing locations for said respective nets. Fixture probes are preferably inserted in the PCB tester fixture design at respective preferred probing locations such that tips of said respective fixture probes exactly align with corresponding preferred test pads of a PCB implemented in accordance with the PCB design should the PCB be mounted in a printed circuit board tester fixture implemented in accordance with the PCB tester fixture design.
摘要:
A method and apparatus for a wiping fixture probe for cleaning oxides, residues or other contaminants from the surface of a solder bead probe and probing a solder bead probe on a printed circuit board during in-circuit testing.
摘要:
A method for generating improved detection and diagnostic test patterns and for improving the diagnostic resolution of interconnect testing of a circuit is based on the premise that short-circuits are most likely to result from solder bridges between closely adjacent pins. In a first embodiment, an optimal boundary-scan test pattern is generated. In a second embodiment, boundary-scan test diagnosis is enhanced by utilizing x,y coordinate data corresponding to the physical location of devices on the tested circuit. In a third embodiment, diagnosis of unpowered short-circuit testing is enhanced.
摘要:
A method for testing a circuit board having both boundary-scan and non-boundary-scan devices is provided. The test method distinguishes boundary-scan nodes from non-boundary-scan nodes and uses cartesian coordinates (X,Y) of every pin of every device on the circuit board to determine a number of sets of non-boundary-scan nodes that are within a predetermined distance "R" from a device pin coupled to a boundary-scan node. The number of sets of non-boundary-scan nodes are grouped into "independent" groups which can be tested in parallel. A test cycle is performed by testing independent non-boundary-scan nodes in parallel by forcing drivers in the boundary-scan devices to a first logic state, and forcing each of the non-boundary-scan nodes to another logic state for a brief interval. Receivers on the boundary-scan devices capture a response vector during the brief interval, which is scanned out of the circuit board for evaluation. The response vector reflects which of the nodes has failed, and cartesian coordinate data giving the precise location of any faulty node(s) is returned to user.
摘要:
The (X,Y) positions of the nodes in a circuit containing boundary scan components and non-boundary-scan components are stored in a computer. The computer selects a set of non-boundary scan nodes within a radius R of a selected boundary-scan node, R being the length of solder bridges in the circuit. A logic 0 voltage is applied to the set and a boundary-scan test is performed. If the boundary-scan test fails, a fault is declared in the circuit between the set and the selected boundary-scan node. A logic 1 voltage is applied to one of the nodes in the set, and the test repeated. If the test returns different results, the fault is declared between that one node and the selected boundary-scan node. A time limit is established for each non-boundary scan node corresponding to the length of time a short in that node can be tolerated. The boundary-scan nodes in the circuit are tested in the order of ascending time limits in its associated set. Power is cut off to the circuit if the time limit of a node not yet tested, or tested and failed, is exceeded.
摘要:
A method and apparatus for detecting open defects on grounded nodes of an electrical device using capacitive lead frame technology is presented. In accordance with the method of the invention, an accessible signal node that is capacitively coupled the grounded node is stimulated with a known source signal. A capacitive sense plate is capacitively coupled to the stimulated node and grounded node of the electrical device, and a measuring device coupled to the capacitive sense plate capacitively senses a resulting signal. The value of the capacitively sensed signal is indicative of the presence or non-presence of an open defect on one or both of the grounded node and stimulated signal node.
摘要:
A twisting fixture probe for cleaning oxides, residues or other contaminants from the surface of a solder bead probe and probing a solder bead probe on a printed circuit board during in-circuit testing.