公开(公告)号：US20060242912A1

公开(公告)日：2006-11-02

申请号：US10531125

申请日：2003-07-30

申请人： Hyun Roh ,  Tae Park ,  Kill Lee ,  In Lee

发明人： Hyun Roh ,  Tae Park ,  Kill Lee ,  In Lee

IPC分类号： B24D3/02

CPC分类号： H01L21/30625 ,  C09G1/02

摘要： Disclosed is a slurry composition for secondary polishing of silicon wafers comprising: 2˜10 weight % of colloidal silica having an average particle size of 30˜80 nm; 0.5˜1.5 % by weight of ammonia; 0.2˜1 weight % of a hydroxyalkycellulose-based polymer for modifying rheology of the composition; 0.03˜0.5 weight % of a polyoxyethylenealkylamine ether-based nonionic surfactant; 0.01˜1 weight % of a quaternary ammonium base and the balance of deionized water.