公开(公告)号：US4134808A

公开(公告)日：1979-01-16

申请号：US870470

申请日：1978-01-18

申请人： Gunter Kruger ,  Klaus Kuttner ,  Manfred Widmaier ,  Erich Leinauer

发明人： Gunter Kruger ,  Klaus Kuttner ,  Manfred Widmaier ,  Erich Leinauer

IPC分类号： H01C17/26 ,  H01L21/70 ,  H01L27/01 ,  H05K3/22 ,  C25F3/02 ,  C25D21/12 ,  C25F5/00

CPC分类号： H01L21/707

摘要： A thin film path of medium resistivity provided by a strip of tantalum by which a design parameter of an electronic component is determined is modified by making contact with the path by an electrode having an electrolyte at its tip in passing an anodizing current into the path through the electrode that is much smaller in value than the normal current flowing through the path under design conditions of operation. In consequence, the current injected to produce chemical change in the resistance has a negligible effect on the characteristics of operation of the component and the component can have operating conditions applied to it during the trimming process can be carried while the component is under operating conditions and the parameter to be adjusted is being measured, so that the measurements of the parameter can control the current injected through the electrode so as to shut it off when the desired value of the measured parameter is reached. When the difference between actual and desired values reaches a certain small value, it is advantageous to switch over the current source for the electrode to a lower value of current in order to make possible a closer approach to the design value.

摘要翻译： 由电子元件的设计参数确定的由钽带提供的中等电阻率的薄膜路径是通过在其尖端处具有电解质的电极与路径接触而改变的，所述电极通过阳极氧化电流进入通路 该电极的值比在设计操作条件下流过路径的正常电流小得多。 因此，注入以产生电阻的化学变化的电流对组件的操作特性具有可忽略的影响，并且组件可以在修整过程中施加的操作条件可以在组件处于操作条件下进行，并且 正在测量要调节的参数，使得参数的测量可以控制通过电极注入的电流，以便在达到测量参数的期望值时关闭电流。 当实际值和期望值之间的差值达到一定的小值时，有利的是将电极的电流源切换到较低的电流值，以便使设计值更接近。

公开(公告)号：US4075416A

公开(公告)日：1978-02-21

申请号：US652728

申请日：1976-01-27

申请人： Klaus Kuttner ,  Gunter Kruger ,  Fedor Modic

发明人： Klaus Kuttner ,  Gunter Kruger ,  Fedor Modic

IPC分类号： H01L27/01 ,  H05K1/16 ,  H05K1/00

CPC分类号： H01L27/016

摘要： After a valve metal layer on an insulating substrate has been metallized by sputtering on two layers of copper separated by an intermediate layer of iron, nickel or cobalt, and the combined circuit and component pattern has been etched out, followed by selectively etching away the metallization over the resistance components of the circuit, electroless deposited nickel and gold layers are successively applied to the remaining metallization and a solder layer is then applied on top by contact with liquid solder.