公开(公告)号：US4772125A

公开(公告)日：1988-09-20

申请号：US875974

申请日：1986-06-19

申请人： Kazushi Yoshimura ,  Takashi Hiroi ,  Takanori Ninomiya ,  Toshimitsu Hamada ,  Yasuo Nakagawa ,  Kohichi Karasaki

发明人： Kazushi Yoshimura ,  Takashi Hiroi ,  Takanori Ninomiya ,  Toshimitsu Hamada ,  Yasuo Nakagawa ,  Kohichi Karasaki

IPC分类号： G01B11/24 ,  G01N21/64 ,  G01N21/88 ,  G01N21/956 ,  G06T7/00

CPC分类号： G06T7/0006 ,  G01N21/95684 ,  G01N2021/95646 ,  G01N21/64 ,  G06T2207/10064 ,  G06T2207/30152

摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.

摘要翻译： 一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。 利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到 根据其产生。 图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。