公开(公告)号：US4772125A

公开(公告)日：1988-09-20

申请号：US875974

申请日：1986-06-19

申请人： Kazushi Yoshimura ,  Takashi Hiroi ,  Takanori Ninomiya ,  Toshimitsu Hamada ,  Yasuo Nakagawa ,  Kohichi Karasaki

发明人： Kazushi Yoshimura ,  Takashi Hiroi ,  Takanori Ninomiya ,  Toshimitsu Hamada ,  Yasuo Nakagawa ,  Kohichi Karasaki

IPC分类号： G01B11/24 ,  G01N21/64 ,  G01N21/88 ,  G01N21/956 ,  G06T7/00

CPC分类号： G06T7/0006 ,  G01N21/95684 ,  G01N2021/95646 ,  G01N21/64 ,  G06T2207/10064 ,  G06T2207/30152

摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.

摘要翻译： 一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。 利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到 根据其产生。 图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。

公开(公告)号：US4641527A

公开(公告)日：1987-02-10

申请号：US707501

申请日：1985-03-04

申请人： Takashi Hiroi ,  Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Takashi Hiroi ,  Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： G01N21/956 ,  G01R31/02 ,  G01N29/04

CPC分类号： G01R31/026 ,  G01N21/956 ,  G01N2021/479

摘要： An object to be inspected which is jointed to a circuit board is vibrated in a contactless manner by applying a gas jet or a magnetic force to the object, a laser beam is irradiated on the object, and a laser beam reflected from the object is detected by a linear sensor to observe a laser speckle pattern for the object. Quality of a joint junction state of the object is judged from the laser speckle pattern.

摘要翻译： 通过对物体施加气体射流或磁力，将被检查物体接触电路板以非接触的方式振动，激光束被照射在物体上，检测从物体反射的激光束 通过线性传感器观察物体的激光散斑图案。 从激光斑纹图案判断物体的接合连接状态的质量。

公开(公告)号：US06236057B1

公开(公告)日：2001-05-22

申请号：US09610954

申请日：2000-07-06

申请人： Chie Shishido ,  Takashi Hiroi ,  Haruo Yoda ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Takanori Ninomiya ,  Hideaki Doi ,  Shunji Maeda ,  Mari Nozoe ,  Hiroyuki Shinoda ,  Atsuko Takafuji ,  Aritoshi Sugimoto ,  Yasutsugu Usami

发明人： Chie Shishido ,  Takashi Hiroi ,  Haruo Yoda ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Takanori Ninomiya ,  Hideaki Doi ,  Shunji Maeda ,  Mari Nozoe ,  Hiroyuki Shinoda ,  Atsuko Takafuji ,  Aritoshi Sugimoto ,  Yasutsugu Usami

IPC分类号： G01N2188

CPC分类号： G01N21/95607

摘要： A method and apparatus for inspecting a pattern, a first image of a first area on a sample is acquired by imaging the first area formed as a first pattern, and the first image is memorized. A second image of a second area on the sample is acquired by imaging the second area formed as a second pattern which is to be the same as the first pattern. A defect of the first pattern is detected by acquiring a differential image between the first image and the second image. The detection of the defect includes processing the differential image by using information of brightness corresponding to both of the first image and the second image.

摘要翻译： 通过对形成为第一图案的第一区域进行成像，并记录第一图像来获取用于检查图案的样品的第一区域的第一图像的方法和装置。 通过对形成为与第一图案相同的第二图案的第二区域成像来获取样品上的第二区域的第二图像。 通过获取第一图像和第二图像之间的差分图像来检测第一图案的缺陷。 缺陷的检测包括通过使用与第一图像和第二图像两者相对应的亮度的信息来处理差分图像。

公开(公告)号：US6087673A

公开(公告)日：2000-07-11

申请号：US81636

申请日：1998-05-20

申请人： Chie Shishido ,  Takashi Hiroi ,  Haruo Yoda ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Takanori Ninomiya ,  Hideaki Doi ,  Shunji Maeda ,  Mari Nozoe ,  Hiroyuki Shinoda ,  Atsuko Takafuji ,  Aritoshi Sugimoto ,  Yasutsugu Usami

发明人： Chie Shishido ,  Takashi Hiroi ,  Haruo Yoda ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Takanori Ninomiya ,  Hideaki Doi ,  Shunji Maeda ,  Mari Nozoe ,  Hiroyuki Shinoda ,  Atsuko Takafuji ,  Aritoshi Sugimoto ,  Yasutsugu Usami

IPC分类号： G01N23/20 ,  G01N21/88 ,  G01N21/956 ,  G01N23/225 ,  G06T1/00 ,  H01L21/66

CPC分类号： G01N21/95607

摘要： In a method of inspecting a defect and an apparatus thereof, an allowable range for a gradation value of a difference image is determined for each pixel from one pixel or less of position shift quantity between two images to be compared, a variation rate in a local gradation value of an image, and a representative value of the local gradation value. Then, by comparing the gradation value of the difference image with the allowable range determined for each pixel, a pixel, on which the gradation value of the difference image is within the allowable range, is judged to be an non-defective candidate and a pixel, on which the gradation value of the difference image is beyond the allowable range, is judged to be a defective candidate. This reduces the number of false information caused by mismatches attributed to an object to be inspected and an image detecting system, such as an infinitesimal difference in pattern configuration, a difference in the gradation value, a distortion of a pattern, and a position shift, thus making it possible to detect a more minute defect.

摘要翻译： 在检查缺陷的方法和装置中，针对要比较的两个图像之间的位置偏移量的一个像素或更少的像素，针对每个像素确定差分图像的灰度值的允许范围，局部变化率 图像的灰度值和局部灰度值的代表值。 然后，通过将差分图像的灰度值与对于每个像素确定的容许范围进行比较，将差分图像的灰度值在允许范围内的像素判断为无缺陷候选和像素 ，其中差分图像的灰度值超出允许范围，被判断为缺陷候选。 这减少了归因于待检查对象的失配和图像检测系统引起的错误信息的数量，例如图案配置中的无穷小差异，灰度值的差异，图案的失真和位置偏移， 从而可以检测到更小的缺陷。

公开(公告)号：US06614923B1

公开(公告)日：2003-09-02

申请号：US09225512

申请日：1999-01-06

申请人： Chie Shishido ,  Yuji Takagi ,  Shuji Maeda ,  Takanori Ninomiya ,  Takashi Hiroi ,  Masahiro Watanabe ,  Hideaki Doi

发明人： Chie Shishido ,  Yuji Takagi ,  Shuji Maeda ,  Takanori Ninomiya ,  Takashi Hiroi ,  Masahiro Watanabe ,  Hideaki Doi

IPC分类号： G06K932

CPC分类号： G06T7/001 ,  G06T5/006 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01J37/226 ,  H01J37/28 ,  H01J2237/2448 ,  H01J2237/24592 ,  H01J2237/2482 ,  H01J2237/2806 ,  H01J2237/2817

摘要： For purpose of providing a defect inspecting method and an apparatus thereof and a defect inspecting method on basis of electron beam image and an apparatus thereof, reducing possibility of bringing erroneous or false reports due to the test objection side and the inspecting apparatus side, being caused by discrepancies, such as the minute difference in pattern shapes, the difference in gradation values, the distortion or deformation of the patterns, the position shift, thereby enabling the detection of the defects or the defective candidates in more details, wherein an image which is small in distortion by controlling the electron beam scanning is detected and divided into a size so as to be able to neglect therefrom, and then position shift detection and defect decision are carried out in an accuracy less or finer than pixel for each division unit. In the defect decision, a desired tolerance can be set up depending upon changes in gradation values and the position shift.

摘要翻译： 为了提供基于电子束图像的缺陷检查方法及其装置和缺陷检查方法及其装置，减少由于检测对象侧和检查装置侧引起错误或错误的报告的可能性 通过差异，例如图案形状的微小差异，灰度值的差异，图案的变形或变形，位置偏移，从而能够更详细地检测缺陷或缺陷候选物，其中，图像是 检测出通过控制电子束扫描而具有较小的失真，并将其分割成能够忽略的尺寸，然后针对每个分割单元以比像素少的精度执行位移检测和缺陷判定。 在缺陷判定中，可以根据灰度值和位置偏移的变化来建立期望的公差。

公开(公告)号：US06376854B2

公开(公告)日：2002-04-23

申请号：US09848422

申请日：2001-05-04

申请人： Chie Shishido ,  Takashi Hiroi ,  Haruo Yoda ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Takanori Ninomiya ,  Hideaki Doi ,  Shunji Maeda ,  Mari Nozoe ,  Hiroyuki Shinoda ,  Atsuko Takafuji ,  Aritoshi Sugimoto ,  Yasutsugu Usami

发明人： Chie Shishido ,  Takashi Hiroi ,  Haruo Yoda ,  Masahiro Watanabe ,  Asahiro Kuni ,  Maki Tanaka ,  Takanori Ninomiya ,  Hideaki Doi ,  Shunji Maeda ,  Mari Nozoe ,  Hiroyuki Shinoda ,  Atsuko Takafuji ,  Aritoshi Sugimoto ,  Yasutsugu Usami

IPC分类号： G01N2188

CPC分类号： G01N21/95607

摘要： A method for inspecting a pattern formed on a substrate, includes the steps of moving a table along a first direction on which a substrate to be inspected is mounted, irradiating a converged electron beam on the substrate by scanning the converged electron beam along a second direction which is perpendicular to the first direction; detecting an electron radiated from the substrate by the irradiation of the converged electron beam in which the movement of the table and the scanning of the converged electron beam are synchronized; forming a digital image of the substrate from the detected electron; improving a quality of the digital image by filtering the digital image; and detecting a defect of a pattern formed on the substrate by using the improved quality digital image.

摘要翻译： 一种用于检查形成在基板上的图案的方法，包括以下步骤：沿着安装有待检查的基板的第一方向移动工作台，通过沿第二方向扫描会聚的电子束将会聚的电子束照射在基板上 其垂直于第一方向; 通过会聚电子束的照射来检测从基板辐射的电子，其中台的移动和会聚电子束的扫描同步; 从检测到的电子形成衬底的数字图像; 通过过滤数字图像来提高数字图像的质量; 以及通过使用改进的质量数字图像来检测在基板上形成的图案的缺陷。

公开(公告)号：US20080302964A1

公开(公告)日：2008-12-11

申请号：US12190388

申请日：2008-08-12

申请人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

发明人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

IPC分类号： G01N23/00 ,  G01R31/305

CPC分类号： G01R31/305 ,  G01R31/307 ,  H01J37/28 ,  H01J2237/2817

摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined changed state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.

摘要翻译： 电路图案检查方法及其装置，其中待检查的样品的待检查部分的整体部分处于预定的改变状态，被检查的部分用成像高分辨率照射， 在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级 通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

公开(公告)号：US07417444B2

公开(公告)日：2008-08-26

申请号：US11269617

申请日：2005-11-09

申请人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

发明人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

IPC分类号： G01R31/305 ,  H01J37/28

CPC分类号： G01R31/305 ,  G01R31/307 ,  H01J37/28 ,  H01J2237/2817

摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.

摘要翻译： 一种电路图案检查方法及其装置，其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态，被检查的部分用图像形成高分辨率照射， 在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级 通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。

公开(公告)号：US07026830B2

公开(公告)日：2006-04-11

申请号：US10379555

申请日：2003-03-06

申请人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

发明人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

IPC分类号： G01R31/305 ,  G01R31/28

CPC分类号： G01R31/305 ,  G01R31/307 ,  H01J37/28 ,  H01J2237/2817

摘要： To make possible the in-line inspection of a pattern of an insulating material.A patterned wafer 40 formed with a pattern by a resist film is placed on a specimen table 21 of a patterned wafer inspection apparatus 1 in opposed relation to a SEM 3. An electron beam 10 of a large current is emitted from an electron gun 11 and the pattern of the patterned wafer is scanned only once at a high scanning rate. The secondary electrons generated by this scanning from the patterned wafer are detected by a secondary electron detector 16 thereby to acquire an electron beam image. Using this electron beam image, the comparative inspection is conducted on the patterned wafer through an arithmetic operation unit 32 and a defect determining unit 33. Since an electron beam image of high contrast can be obtained by scanning an electron beam only once, a patterned wafer inspection method using a SEM can be implemented in the IC fabrication method.

摘要翻译： 使绝缘材料的图案能够在线检查。 通过抗蚀剂膜形成图案的图案化晶片40与SEM 3相对地放置在图案化晶片检查装置1的样本台21上。 从电子枪11发射大电流的电子束10，以高扫描速度扫描图案化晶片的图案一次。 通过二次电子检测器16检测来自图案化晶片的该扫描产生的二次电子，从而获得电子束图像。 使用该电子束图像，通过算术运算单元32和缺陷判定单元33对图案化晶片进行比较检查。由于可以通过仅扫描电子束一次来获得高对比度的电子束图像，因此图案化晶片 使用SEM的检查方法可以在IC制造方法中实现。

公开(公告)号：US20060043982A1

公开(公告)日：2006-03-02

申请号：US11269617

申请日：2005-11-09

申请人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

发明人： Hiroyuki Shinada ,  Mari Nozoe ,  Haruo Yoda ,  Kimiaki Ando ,  Katsuhiro Kuroda ,  Yutaka Kaneko ,  Maki Tanaka ,  Shunji Maeda ,  Hitoshi Kubota ,  Aritoshi Sugimoto ,  Katsuya Sugiyama ,  Atsuko Takafuji ,  Yusuke Yajima ,  Hiroshi Tooyama ,  Tadao Ino ,  Takashi Hiroi ,  Kazushi Yoshimura ,  Yasutsugu Usami

IPC分类号： G01R31/305

CPC分类号： G01R31/305 ,  G01R31/307 ,  H01J37/28 ,  H01J2237/2817

摘要： A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is irradiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.

摘要翻译： 一种电路图案检查方法及其装置，其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态，被检查的部分用图像形成高分辨率照射， 在扫描电子束时，在从电子束照射的时刻起经过规定的时间后，在照射电子束的部分检测到二次带电粒子，根据这样检测的次级 通过使用如此形成的图像来检查带电粒子信号，并检查待检查的部分。