公开(公告)号：US08258013B1

公开(公告)日：2012-09-04

申请号：US12705441

申请日：2010-02-12

申请人： Kumar Nagarajan ,  S. Gabriel R. Dosdos ,  Dong W. Kim ,  Kong W. Lee

发明人： Kumar Nagarajan ,  S. Gabriel R. Dosdos ,  Dong W. Kim ,  Kong W. Lee

IPC分类号： H01L23/10 ,  H01L21/00

CPC分类号： H01L23/564 ,  H01L23/3128 ,  H01L23/3733 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/00

摘要： An integrated circuit package assembly includes a substrate, a semiconductor die having opposing first and second surfaces, and a head-spreader. The semiconductor die is mounted on the substrate with the first surface facing the substrate. The heat-spreader includes a central region thermally coupled to the second surface of the semiconductor die, a flange region mounted on the substrate, and a side wall region between the central and flange regions. A cavity is formed between the heat-spreader, the substrate, and the semiconductor die. The heat-spreader has at least one vent extending from the cavity through the heat-spreader.

摘要翻译： 集成电路封装组件包括衬底，具有相对的第一表面和第二表面的半导体管芯，以及头戴式撒布机。 半导体管芯安装在衬底上，第一表面面向衬底。 散热器包括热耦合到半导体管芯的第二表面的中心区域，安装在基板上的凸缘区域和中心区域和凸缘区域之间的侧壁区域。 在散热器，基板和半导体管芯之间形成空腔。 散热器具有至少一个从空腔延伸通过散热器的通风口。