BIPOLAR TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    BIPOLAR TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME 有权
    双极晶体管及其制造方法

    公开(公告)号:US20130001747A1

    公开(公告)日:2013-01-03

    申请号:US13519252

    申请日:2010-12-02

    IPC分类号: H01L21/331 H01L29/732

    CPC分类号: H01L29/66272

    摘要: A method for manufacturing a bipolar transistor includes forming a first epitaxial layer on a semiconductor substrate, forming a second epitaxial layer on the first epitaxial layer, forming an oxide layer on the second epitaxial layer, etching the oxide layer to form an opening in which the second epitaxial layer is exposed, and forming a third epitaxial layer in the opening. The first and third epitaxial layers have a first-type conductivity, and the second epitaxial layer has a second-type conductivity.

    摘要翻译: 一种用于制造双极晶体管的方法,包括在半导体衬底上形成第一外延层,在第一外延层上形成第二外延层,在第二外延层上形成氧化层,蚀刻氧化物层以形成开口, 暴露第二外延层,并在开口中形成第三外延层。 第一和第三外延层具有第一类型的导电性,第二外延层具有第二类型的导电性。

    Bipolar transistor and method for manufacturing the same
    2.
    发明授权
    Bipolar transistor and method for manufacturing the same 有权
    双极晶体管及其制造方法

    公开(公告)号:US08729669B2

    公开(公告)日:2014-05-20

    申请号:US13519252

    申请日:2010-12-02

    IPC分类号: H01L29/02

    CPC分类号: H01L29/66272

    摘要: A method for manufacturing a bipolar transistor includes forming a first epitaxial layer on a semiconductor substrate, forming a second epitaxial layer on the first epitaxial layer, forming an oxide layer on the second epitaxial layer, etching the oxide layer to form an opening in which the second epitaxial layer is exposed, and forming a third epitaxial layer in the opening. The first and third epitaxial layers have a first-type conductivity, and the second epitaxial layer has a second-type conductivity.

    摘要翻译: 一种用于制造双极晶体管的方法,包括在半导体衬底上形成第一外延层,在第一外延层上形成第二外延层,在第二外延层上形成氧化层,蚀刻氧化物层以形成开口, 暴露第二外延层,并在开口中形成第三外延层。 第一和第三外延层具有第一类型的导电性,第二外延层具有第二类型的导电性。