Polyethylene Resin Compositions Having Low Mi And High Melt Strengh
    2.
    发明申请
    Polyethylene Resin Compositions Having Low Mi And High Melt Strengh 审中-公开
    具有低密度和高熔体强度的聚乙烯树脂组合物

    公开(公告)号:US20080125547A1

    公开(公告)日:2008-05-29

    申请号:US11816970

    申请日:2006-03-03

    Abstract: Ethylene polymer compositions comprising a high molecular weight high density polyethylene resin and a low density polyethylene resin are disclosed, where the polymer composition has a comparatively high melt strength for a given melt index. The compositions comprise from 25 to 99 percent by weight of the composition of a linear or substantially linear polyethylene polymer having a density of at least about 0.90 g/cc, and an I21 of less than about 20; and from 1 to 25 percent by weight of the composition of a high pressure low density type polyethylene resin having a melt index (I2) less than about 5, a molecular weight distribution greater than about 10, a Mw_abs/Mw_gpc ratio (“Gr”) of at least 2.7, and a melt strength at 190° C. greater than 19.0−12.6*log10(Mi). The compositions of the present invention are particularly well suited for blown film and thermoforming applications.

    Abstract translation: 公开了包含高分子量高密度聚乙烯树脂和低密度聚乙烯树脂的乙烯聚合物组合物,其中聚合物组合物对于给定的熔体指数具有相对较高的熔体强度。 该组合物包含25至99重量%的组合物,其密度为至少约0.90g / cc,I21小于约20的直链或基本上线性的聚乙烯聚合物; 和组合物的1至25重量%的熔体指数(I 2)小于约5,分子量分布大于约10,Mw_abs / Mw_gpc比(“Gr”)的高压低密度型聚乙烯树脂, )至少为2.7,熔体强度为190℃,大于19.0-12.6 * log10(Mi)。 本发明的组合物特别适用于吹塑薄膜和热成型应用。

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