摘要:
A computer front bezel includes a bezel body (10), a cover (20) pivotably attached to the bezel body, and a connecting bar (30) connecting with the bezel body and the cover. The cover has an open position and a closed position. The connecting bar has first and second end portions. When the connecting bar is located in the first position, the cover is supported by the connecting bar, and lies in the open position, and when the connecting bar is located in the second position, the cover lies in the closed position.
摘要:
A method of forming a capacitor of a mixed-mode device is described. Trenches used for forming a trench-type capacitor are simultaneously formed in a provided substrate while forming a shallow trench isolation. A conductive region used as a lower electrode is formed by ion implantation. A gate oxide layer, used for dielectric film, and a polysilicon layer, used as a gate and an upper electrode, are formed over the substrate and over the trenches. A trench-type capacitor is thus formed.
摘要:
A flash memory cell. A spacer is formed on a sidewall of a controlling gate. A self-aligned source/drain region can thus be formed by the formation of the spacer. The tunneling oxide layer is then formed on the source/drain region instead of on the controlling gate. Thus, the tunneling oxide layer is formed with a self-aligned process.
摘要:
A method for fabricating a flash memory is provided. The method contains sequentially forming a tunneling oxide layer, a polysilicon layer, and a silicon nitride layer on a semiconductor substrate. Patterning the silicon nitride layer, polysilicon layer, the tunneling oxide layer, and the substrate forms a trench in the substrate. A shallow trench isolation (STI) structure is formed to fill the trench up the silicon nitride layer. The silicon nitride layer is removed to expose the polysilicon layer and a portion of each sidewall of the STI structure. A polysilicon spacer is formed on each exposed sidewall of the STI structure. An upper portion of the STI structure is removed so as to expose a portion of each sidewall of the polysilicon layer. The polysilicon layer serves as a floating gate. A conformal dielectric layer and a top polysilicon layer are formed over the substrate. The top polysilicon layer, the dielectric layer, and the polysilicon layer are patterned to form a strip control gate, which covers the floating gate, that is a remaining portion of the polysilicon layer on the tunneling oxide layer.
摘要:
A method of fabricating a flash memory cell. A spacer is formed on a sidewall of a controlling gate. A self-aligned source/drain region can thus be formed by the formation of the spacer. The tunneling oxide layer is then formed on the source/drain region instead of on the controlling gate. Thus, the tunneling oxide layer is formed with a self-aligned process.
摘要:
A method for manufacturing a flash memory. A substrate having a patterned pad oxide layer formed thereon and a patterned mask layer on the pad oxide layer is provided. A doped region is formed in the substrate exposed by the patterned mask layer and the pad oxide layer. A spacer is formed on the sidewall of the patterned mask layer and the pad oxide layer to cover a portion of the doped region. A trench is formed in the substrate exposed by the mask layer and the spacer. An insulating layer is formed to fill the trench, wherein the insulating layer leveled with a top surface of the patterned mask layer. The patterned mask layer and the spacer are removed to respectively expose the patterned oxide layer and the portion of the doped region. A self-aligned tunnel oxide layer is formed on the portion of the doped region. A patterned first conductive layer is formed over the substrate to expose portions of the patterned pad oxide layer above the substrate excluding the doped region. A self-aligned doped region is formed in the substrate under the patterned pad oxide layer exposed by the patterned first conductive layer. A dielectric layer is formed on the patterned first conductive layer and the self-aligned doped region. A patterned second conductive layer is formed over the substrate.
摘要:
An electronic device includes a frame, a front panel secured to the frame, two light sources secured to the front panel, and a light bar. The frame includes a first sidewall, a second sidewall, and a top wall connected to the first sidewall and the second sidewall. A first supporting portion is located between the first sidewall and the top wall. A second supporting portion is located between the second sidewall and the top wall. The top wall, the first supporting portion, and the second supporting portion cooperatively define an installation hole. A light bar includes a body including a bridge and a light guiding portion located on the bridge. The bridge is located on the supporting portion and the second supporting portion. The light guiding portion is engaged in the installation hole. Two light sources are aligned with two opposite sides of the light guiding portion.
摘要:
A mounting assembly includes a chassis having a wall, a fastener pivotally attached to the wall, and a cover detachably attached to the chassis. The wall forms a support portion for supporting a slot cover of an expansion card thereon. The fastener includes a pressing portion for pressing the slot cover against the support portion when the fastener is pivoted to a locked position. The cover is engagable with the fastener to secure the fastener in the locked position.
摘要:
A computer enclosure includes a chassis (30), a side panel (10), a clip piece (25) and a button (21). The chassis includes an elastic tab (353) with a free end titled. The side panel is mounted on the chassis. The clip piece is attached to the side panel. The clip piece defines an opening (253) therein. The clip piece engages with the free end of the elastic tab for securing the side panel on the chassis. The button is disposed on the side panel. The button has a post (213) extending through the opening of the side panel for disengaging the elastic tab from the clip piece, thereby moving the side panel away from the chassis.