公开(公告)号：US20140354314A1

公开(公告)日：2014-12-04

申请号：US13907454

申请日：2013-05-31

Applicant: Hitesh Arora ,  Lawrence D. Decesare, JR. ,  Kelly P. Lofgreen ,  Andrew C. Lyman ,  Michael A. Schroeder

Inventor： Hitesh Arora ,  Lawrence D. Decesare, JR. ,  Kelly P. Lofgreen ,  Andrew C. Lyman ,  Michael A. Schroeder

IPC: G01R31/28 ,  B23P15/26 ,  F28F3/12

CPC classification number: G01R31/2877 ,  F28F13/00 ,  F28F2013/006 ,  G01R31/2874 ,  G01R31/2896 ,  Y10T29/4935

Abstract: Embodiments of the present disclosure describe thermal interface techniques and configurations. In some embodiments, a thermal interface apparatus may include a flexible container, a plurality of thermally conductive objects disposed within the flexible container, and an attachment member coupled to the flexible container for attaching the thermal interface apparatus to a heat sink. The thermally conductive objects may be movable to rearrange their packing within the flexible container in response to deformation of the flexible container. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了热接口技术和配置。 在一些实施例中，热接口设备可以包括柔性容器，设置在柔性容器内的多个导热物体，以及耦合到柔性容器的附接构件，用于将热界面装置附接到散热器。 导热物体可以是可移动的，以便响应于柔性容器的变形而在柔性容器内重新布置其包装。 可以描述和/或要求保护其他实施例。