Planar heater stack and method for making planar heater stack with cavity within planar heater substrata above substrate
    1.
    发明授权
    Planar heater stack and method for making planar heater stack with cavity within planar heater substrata above substrate 有权
    平面加热器堆叠和方法,用于在基板上方的平面加热器基底内制造具有空腔的平面加热器堆叠

    公开(公告)号:US08888251B2

    公开(公告)日:2014-11-18

    申请号:US13432209

    申请日:2012-03-28

    摘要: A heater stuck includes first strata having a planar configuration supporting and forming a fluid heater element responsive to repetitive electrical activation and deactivation to produce repetitive cycles of fluid ejection from an ejection chamber above the heater element and second strata having a planar configuration coating the heater element of the first strata and being contiguous with the ejection chamber to protect the heater element. The first strata include a substrate and heater strata disposed on it and forming a cavity above the substrate and encompassed on three sides by the heater substrata. The heater substrata includes a pair of conductive layer portions constituting terminal leads disposed on the substrate at opposite sides of the cavity and a resistive layer disposed on the conductive layer portions and defining the fluid heater element that spans the top of the cavity.

    摘要翻译: 加热器卡住包括支撑并形成流体加热器元件的第一层,其响应于重复的电激活和停用,以产生从加热器元件上方的喷射室流体喷射的重复循环,并且具有涂覆加热器元件的平面构造的第二层 并且与喷射室邻接以保护加热器元件。 第一层包括设置在其上的衬底和加热器层,并在衬底上形成空腔,并且通过加热器衬底包围在三侧。 加热器基体包括一对导电层部分,构成在空腔的相对侧设置在基板上的端子引线,以及设置在导电层部分上并限定跨过空腔顶部的流体加热器元件的电阻层。

    Fin-shaped heater stack and method for formation
    2.
    发明授权
    Fin-shaped heater stack and method for formation 有权
    鳍形加热器堆叠和形成方法

    公开(公告)号:US08366245B2

    公开(公告)日:2013-02-05

    申请号:US12344706

    申请日:2008-12-29

    IPC分类号: B41J2/05

    摘要: A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata.

    摘要翻译: 鳍状加热器堆叠包括构造成支撑并形成流体加热器元件的第一层,其响应于重复的电激活和停用以产生流体的重复循环和第一层上的第二层,以保护流体加热器元件免受不利影响 流体喷射和与流体接触的重复循环。 第一层包括具有前表面的基底和支撑在前表面上的加热器基底。 加热器基体具有相对的前表面大致垂直延伸的相对的侧表面,以及使大致平行于前表面延伸的侧表面相互连接的端面,使得加热器基底以直立或倒立的翅片形状设置在 具有流体加热器元件的基底形成加热基底的相对面对的侧表面。

    Process for making a micro-fluid ejection head structure
    3.
    发明授权
    Process for making a micro-fluid ejection head structure 有权
    制造微流体喷射头结构的方法

    公开(公告)号:US08158336B2

    公开(公告)日:2012-04-17

    申请号:US12786803

    申请日:2010-05-25

    IPC分类号: B41J2/16

    摘要: A method of making a micro-fluid ejection head structure and micro-fluid ejection heads made by the method. The method includes applying a tantalum oxide layer to a surface of a fluid ejection actuator disposed on a device surface of a substrate so that the tantalum oxide layer is the topmost layer of a plurality of layers including a resistive layer, and a protective layer selected from a passivation layer, a cavitation layer, and a combination of a passivation layer and a cavitation layer. The tantalum oxide layer has a thickness (t) that satisfies an equation t=(¼*W/n), wherein W is a wavelength of radiation from a radiation source, and n is a refractive index of the tantalum oxide layer. A photoimageable layer is also applied to the substrate. The photoimageable layer is imaged with the radiation source and then developed.

    摘要翻译: 通过该方法制造微流体喷射头结构和微流体喷射头的方法。 该方法包括将氧化钽层施加到设置在基板的器件表面上的流体喷射致动器的表面,使得钽氧化物层是包括电阻层的多个层的最顶层,以及选自 钝化层,空穴层以及钝化层和空化层的组合。 氧化钽层具有满足方程式t =(¼* W / n)的厚度(t),其中W是来自辐射源的辐射的波长,n是氧化钽层的折射率。 光致成像层也可应用于基板。 可光成像层用辐射源成像,然后显影。

    Heater stack having resistive layer with underlying insulative gap and method for making heater stack
    4.
    发明授权
    Heater stack having resistive layer with underlying insulative gap and method for making heater stack 有权
    具有下层绝缘间隙的电阻层的加热器堆叠和用于制造加热器堆叠的方法

    公开(公告)号:US08042912B2

    公开(公告)日:2011-10-25

    申请号:US12345091

    申请日:2008-12-29

    IPC分类号: B41J2/05

    摘要: A heater stack includes first strata configured to support and form a fluid heater element responsive to energy from repetitive electrical activation and deactivation to fire repetitive cycles of heating and ejecting fluid from an ejection chamber above the fluid heater element and second strata overlying the first strata and contiguous with the ejection chamber to provide protection of the fluid heater element. The first strata includes a substrate and a heater substrata overlying the substrate and including a resistive layer having lateral portions spaced apart, a central portion extending between the lateral portions and defining the fluid heater element, and transitional portions interconnecting the central portion and lateral portions and elevating the central portion relative to the lateral portions and above the substrate to form a gap between the lateral portions and between the central portion and substrate insulating the substrate from the fluid heater element.

    摘要翻译: 加热器堆叠包括构造成支撑并形成流体加热器元件的第一层,所述第一层响应于来自重复的电激活和去激活的能量来发射加热和喷射流体的重复循环,所述喷射室从位于流体加热器元件上方的喷射室和覆盖在第一层上的第二层, 与喷射室邻接以提供对流体加热器元件的保护。 第一层包括衬底和覆盖衬底的加热器衬底,并且包括具有间隔开的侧面部分的电阻层,在侧面部分之间延伸并限定流体加热器元件的中心部分,以及将中心部分和侧部部分互连的过渡部分 相对于侧面部分和基板上方升高中心部分,以在侧向部分之间以及中心部分和基板之间形成间隙,从而使基板与流体加热器元件绝缘。

    HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE
    5.
    发明申请
    HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE 有权
    硅胶衬垫加热硅胶衬垫

    公开(公告)号:US20110205305A1

    公开(公告)日:2011-08-25

    申请号:US13102091

    申请日:2011-05-06

    IPC分类号: B41J2/05

    摘要: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.

    摘要翻译: 加热器芯片具有基板和至少一个由硅制成的管芯,以及非粘合地连接的管芯。 厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。 模具具有从背面到表面的墨水流通孔,以及包括与前述表面相邻的加热元件的电路,其中散布着墨水通孔。 至少一个管芯叠加在衬底上,使得衬底的供墨通孔与管芯的墨流过孔对准,并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。 在衬底和面向芯片的表面部分之间形成的结合是密封的,并且与Si-O键的强度相等。 通过模具的金属将基板前部的导体连接到模具前部的加热元件。

    Heater Stack Having Resistive Layer with Underlying Insulative Gap and Method for Making Heater Stack
    6.
    发明申请
    Heater Stack Having Resistive Layer with Underlying Insulative Gap and Method for Making Heater Stack 有权
    加热器堆叠具有基础绝缘间隙的电阻层和制作加热器堆叠的方法

    公开(公告)号:US20100165052A1

    公开(公告)日:2010-07-01

    申请号:US12345091

    申请日:2008-12-29

    IPC分类号: B41J2/05

    摘要: A heater stack includes first strata configured to support and form a fluid heater element responsive to energy from repetitive electrical activation and deactivation to fire repetitive cycles of heating and ejecting fluid from an ejection chamber above the fluid heater element and second strata overlying the first strata and contiguous with the ejection chamber to provide protection of the fluid heater element. The first strata includes a substrate and a heater substrata overlying the substrate and including a resistive layer having lateral portions spaced apart, a central portion extending between the lateral portions and defining the fluid heater element, and transitional portions interconnecting the central portion and lateral portions and elevating the central portion relative to the lateral portions and above the substrate to form a gap between the lateral portions and between the central portion and substrate insulating the substrate from the fluid heater element.

    摘要翻译: 加热器堆叠包括构造成支撑并形成流体加热器元件的第一层,所述第一层响应于来自重复的电激活和去激活的能量来发射加热和喷射流体的重复循环,所述喷射室从位于流体加热器元件上方的喷射室和覆盖在第一层上的第二层, 与喷射室邻接以提供对流体加热器元件的保护。 第一层包括衬底和覆盖衬底的加热器衬底,并且包括具有间隔开的侧面部分的电阻层,在侧面部分之间延伸并限定流体加热器元件的中心部分,以及将中心部分和侧部部分互连的过渡部分 相对于侧面部分和基板上方升高中心部分,以在横向部分之间以及中心部分和基板之间形成间隙,从而使基板与流体加热器元件绝缘。

    HEATER STACK AND METHOD FOR MAKING HEATER STACK WITH HEATER ELEMENT DECOUPLED FROM SUBSTRATE
    7.
    发明申请
    HEATER STACK AND METHOD FOR MAKING HEATER STACK WITH HEATER ELEMENT DECOUPLED FROM SUBSTRATE 有权
    加热器堆叠和加热器堆叠的方法由加热器元件从衬底分离

    公开(公告)号:US20100110145A1

    公开(公告)日:2010-05-06

    申请号:US12265092

    申请日:2008-11-05

    IPC分类号: B41J2/05 H01L21/00

    摘要: A heater stack includes first strata configured to support and form a fluid heater element responsive to repetitive electrical activation and deactivation to produce cycles of fluid ejection and second strata overlying the first strata to protect the heater element. A decomposed sacrificial layer of a preselected polymer between the substrate and a heater substrata containing the heater element provides a decoupled relationship between them which, during a heat-up period of each cycle, results in the heater element buckling out of physical contact with substrate enabling the heater element to transfer heat energy for producing fluid ejection into the fluid without transferring any into the substrate whereas the decoupled relationship, during the next following cool-down period of each cycle, results in the heater element de-buckling back into physical contact with the substrate enabling the heater element transfer residual heat energy to the substrate.

    摘要翻译: 加热器堆叠包括构造成支撑并形成流体加热器元件的第一层,其响应于重复的电激活和停用以产生流体喷射循环,并且覆盖第一层的第二层以保护加热器元件。 在基板和包含加热器元件的加热器基底之间的预选聚合物的分解的牺牲层提供了它们之间的去耦合关系,它们在每个循环的加热时段期间导致加热器元件屈曲于与基板的物理接触,使得能够 加热器元件以传递热能以产生流体喷射到流体中而不将任何物质转移到基板中,而在每个循环的接下来的冷却阶段期间的解耦关系导致加热器元件脱扣回到物理接触 该基板使得加热器元件将剩余的热能传递到基板。

    Heater stack and method for making heater stack with cavity between heater element and substrate
    9.
    发明授权
    Heater stack and method for making heater stack with cavity between heater element and substrate 有权
    加热器堆叠和在加热器元件和基板之间制造具有空腔的加热器堆叠的方法

    公开(公告)号:US08079672B2

    公开(公告)日:2011-12-20

    申请号:US12265162

    申请日:2008-11-05

    IPC分类号: B41J2/05

    摘要: A heater stack includes first strata configured to support and form a fluid heater element responsive to repetitive electrical activation and deactivation to produce repetitive cycles of fluid ejection from an ejection chamber above the heater element and second strata overlying the first strata and contiguous with the ejection chamber to protect the heater element. The first strata includes a substrate with a cavity formed either in or above the substrate, a heater substrata overlying the cavity and substrate, and a decomposed layer of material between the substrate and heater substrata and processed to provide the cavity substantially empty of the layer of material such that the cavity provides a means which, during repetitive electrical activation, enables the heater element to transfer heat energy into the fluid in the ejection chamber for producing ejection of fluid therefrom substantially without transferring heat energy into the substrate.

    摘要翻译: 加热器堆叠包括构造成支撑并形成流体加热器元件的第一层,其响应于重复的电激活和停用以产生从加热器元件上方的喷射室的液体喷射的重复循环,以及覆盖在第一层上并与喷射室邻接的第二层 以保护加热器元件。 第一层包括具有形成在基底中或上方的空腔的基底,覆盖空腔和基底的加热器基底,以及在基底和加热器基底之间的材料分解层,并且被处理以提供基本上空的层 材料,使得空腔提供了一种装置,其在重复的电激活期间使得加热器元件能够将热能传递到喷射室中的流体中,用于从基本上不将热能传递到基板中而产生从其流出的流体。

    PROTECTIVE LAYERS FOR MICRO-FLUID EJECTION DEVICES AND METHODS FOR DEPOSITING SAME
    10.
    发明申请
    PROTECTIVE LAYERS FOR MICRO-FLUID EJECTION DEVICES AND METHODS FOR DEPOSITING SAME 审中-公开
    用于微流体喷射装置的保护层及其沉积方法

    公开(公告)号:US20100321447A1

    公开(公告)日:2010-12-23

    申请号:US12851774

    申请日:2010-08-06

    IPC分类号: B41J2/05 H05B3/02

    摘要: Heater chips for a micro-fluid ejection device, such as those having a reduced energy requirement and more efficient production process therefor. One such heater chip includes a resistive layer deposited adjacent to a substrate and a protective layer deposited adjacent to the resistive layer. The protective layer can be a tantalum oxide protective layer, which has a high breakdown voltage. An optional cavitation layer of tantalum, which bonds well with the tantalum oxide layer, may be deposited adjacent to the protective layer. Alternatively, for example, the tantalum oxide layer may serve as both the protective layer and the cavitation layer.

    摘要翻译: 用于微流体喷射装置的加热器芯片,例如具有降低的能量需求并且其更有效的生产工艺的那些。 一个这样的加热器芯片包括邻近衬底沉积的电阻层和邻近电阻层沉积的保护层。 保护层可以是具有高击穿电压的氧化钽保护层。 与氧化钽层良好结合的可选择的空穴层可以沉积在保护层附近。 或者,例如,氧化钽层可以用作保护层和空穴层两者。