摘要:
The invention relates to a method for performing a handover of a mobile device from a source cell to a target cell in a cellular wireless telecommunication network, the method comprising the following steps: configuring the mobile device to transmit a first handover trigger signal to the source cell, when a difference between a signal strength of the target cell and a signal strength of the source cell as measured by the mobile device is above a first threshold (105; determining (S1) if a cell traffic load in the source cell is above a cell traffic load threshold; if so, configuring the mobile device to transmit a second handover trigger signal to the source cell, when a difference between a signal strength of the target cell and a signal strength of the source cell as measured by the mobile device is above a second threshold (100), wherein the first threshold is larger than the second threshold.
摘要:
The invention relates to a method for performing a handover of a mobile device from a source cell to a target cell in a cellular wireless telecommunication network, the method comprising the following steps: configuring the mobile device to transmit a first handover trigger signal to the source cell, when a difference between a signal strength of the target cell and a signal strength of the source cell as measured by the mobile device is above a first threshold (105; determining (S1) if a cell traffic load in the source cell is above a cell traffic load threshold; if so, configuring the mobile device to transmit a second handover trigger signal to the source cell, when a difference between a signal strength of the target cell and a signal strength of the source cell as measured by the mobile device is above a second threshold (100), wherein the first threshold is larger than the second threshold.
摘要:
A mobile terminal is attached to a first network of a first technology type RAT1. The mobile terminal transmits UE capability information to the first network by a plurality of containers. Each container relates to one type of technology which is supported by the mobile terminal. Each container includes an indicator tag identifying the RAT to which its contents relate. On receipt of the containers, the first network decodes the content of the container that is indicated to be of its own technology type. If there is a neighbouring network of another technology type with which the mobile terminal is compatible, the first network sends the relevant container to the second network, where its content is decoded. The second network may return generalized information derived from the container back to the first network. This mechanism provides a content-agnostic approach for transferring mobile capability information between networks of different technology types.
摘要:
A mobile terminal 1 is attached to a first network 2 of a first technology type RAT1. The mobile terminal 1 transmits UE capability information to the first network 2 by a plurality of containers. Each container relates to one type of technology which is supported by the mobile terminal. Each container includes an indicator tag identifying the RAT to which its contents relate. On receipt of the containers, the first network 2 only decodes the content of the container that is indicated to be of its own technology type. If there is a neighbouring network 6 of another technology type with which the mobile terminal is compatible, the first network 2 send the relevant container to the second network, where its content is decoded. The second network may return generalized information derived from the container back to the first network. This mechanism provides a content-agnostic approach for transferring mobile capability information between networks of different technology types.
摘要:
A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For producing the microsystem, electronic components are first integrated in a semiconductor layer provided on a wafer. Subsequently, the semiconductor areas which are not required between the electronic components are etched away, whereupon the flexible foil is applied. A connection line is then applied to the flexible foil so as to interconnect the individual semiconductor elements. Finally, the semiconductor is etched away from the back so as to obtain the microsystem in the case of which the individual semiconductor elements are mechanically connected only by the flexible foil but no longer by the semiconductor substrate.