摘要:
A photovoltaic unit includes a matrix having a plurality of frameless rectangular solar modules, and at least one module rail disposed on an underside of each solar module. Each of the at least one module rail is coupled to a substrate rail, which is releasably connected to a substrate. Each of the at least one module rail and the at least one substrate rail has a guide rail running parallel to an edge of the respective solar module on at least a longitudinal side of the respective rail facing towards an edge region of the solar module. The guide rails on the module and substrate rails are releasably connected to each other by at least one connecting element. A spacer gap of sufficient width for operating the connecting element is provided between adjacent solar modules of the plurality of frameless rectangular solar modules.
摘要:
A mounting device for solar modules having a large aspect ratio in a parallel arrangement on a flat horizontal substrate includes mounting rails having through-holes at predetermined locations. Insertion elements are attached to the mounting rails at the through-holes. Each insertion element includes a one-piece shaped element having a contiguous surface interrupted by an insertion slit configured to receive a lengthwise edge area of a solar module, the insertion slit extending at a predetermined insertion angle. A plastic wedge is configured to secure the received lengthwise edge area of the solar module in the insertion slit.
摘要:
1. Method for determining the distance between two transmitting and receiving stations and transmitting and receiving stations for carrying out the method. 2.1. In automotive engineering transmitting and receiving stations are usually used in keyless locking systems as electronic key modules or evaluation units for identifying the key module. Deactivation of the locking system is prevented if the key module allocated by means of a clear identification number from the evaluation unit is not in the immediate vicinity of the evaluation unit. Communication between the evaluation unit and the key module is carried out by transmitting data telegrams between transmitting and receiving stations. The aim of the invention is to determine the distance between the transmitting and receiving stations in a simple manner. 2.2. According to the novel method, at least three data telegrams are alternately transmitted between the transmitting and receiving stations; when the data telegram is received, each data bit of said data telegram is associated with a counter value corresponding to the counter state of a free-running counter at the moment when the respective data bit is received; a counter sum is associated with each data telegram as a sum or average value of the counter values determined during reception of the data telegram concerned and a sum figure is formed by weighted summation of the counter sums as an indicator of the distance between the transmitting and receiving stations.
摘要:
The invention relates to a multi-level circuit board for high-frequency applications with at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies and with at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material.At least one signal line structure (S1, C1) is provided on the first carrier substrate (PCB1), and at least one ground layer (M2) connected to electric ground potential is provided on a side of at least one second carrier substrate (PCB2, PCB3), and electrical vias (V) extending through the carrier substrates (PCB1,2,3) are provided.A capacitance for removing high-frequency power to ground potential is formed through the at least one second carrier substrate (PCB2, PCB3) toward the ground layer (M2, M4), preferably through two carrier substrates made of the second material toward a metallization surface lying therebetween, in that a metallization surface (C3) having a size corresponding to the desired capacitance is formed on that side of the second carrier substrate (PCB2,4) which is opposite the ground layer (M2, M4) and the metallization surface (C3) is connected to the signal line structure (C1) by means of a via (V(C1-C3)).
摘要:
A solar installation includes at least one solar module. The at least one solar module includes a cover plate and a housing box. The housing box includes housing walls, a frame construction including a substantially L-shaped support profile, the support profile including a transverse leg disposed edge-parallel on a bottom side of the cover plate with a seal interposed therebetween and a longitudinal leg connected to the housing wall. A detent device has at least one upper detent element and one lower detent element for fixing the cover plate on the housing box. A spring-loaded mounting includes at least two spring elements for mounting the cover plate on the housing walls, via the at least two spring elements. The at least two spring elements have a predetermined vertical stroke and are configured to generate a restoring force.
摘要:
A fixing device for fixing a photovoltaic module on a sloping roof having a roof structure and a roof covering with individual roof covering elements includes a roof-side connecting piece disposable beneath the roof covering and a module-side connecting piece disposable on an edge of the photovoltaic module. A flexible retaining element interconnects the roof-side connecting piece and the module-side connecting piece. The flexible retaining element is loadable by pulling and adapted to be guided through the roof covering without altering a position or shape of the individual roof covering elements.
摘要:
The invention relates to a multi-level circuit board for high-frequency applications with at least one first carrier substrate (PCB1) made of a first material suitable for high frequencies and with at least one second carrier substrate (PCB2,3) made of a second material, which second material has higher dielectric losses than the first material.At least one signal line structure (S1, C1) is provided on the first carrier substrate (PCB1), and at least one ground layer (M2) connected to electric ground potential is provided on a side of at least one second carrier substrate (PCB2, PCB3), and electrical vias (V) extending through the carrier substrates (PCB1,2,3) are provided.A capacitance for removing high-frequency power to ground potential is formed through the at least one second carrier substrate (PCB2, PCB3) toward the ground layer (M2, M4), preferably through two carrier substrates made of the second material toward a metallization surface lying therebetween, in that a metallization surface (C3) having a size corresponding to the desired capacitance is formed on that side of the second carrier substrate (PCB2,4) which is opposite the ground layer (M2, M4) and the metallization surface (C3) is connected to the signal line structure (C1) by means of a via (V(C1-C3)).
摘要:
A mounting device for solar modules having a large aspect ratio in a parallel arrangement on a flat horizontal substrate includes mounting rails having through-holes at predetermined locations. Insertion elements are attached to the mounting rails at the through-holes. Each insertion element includes a one-piece shaped element having a contiguous surface interrupted by an insertion slit configured to receive a lengthwise edge area of a solar module, the insertion slit extending at a predetermined insertion angle. A plastic wedge is configured to secure the received lengthwise edge area of the solar module in the insertion slit.
摘要:
A fixing device for fixing a photovoltaic module on a sloping roof having a roof structure and a roof covering with individual roof covering elements includes a roof-side connecting piece disposable beneath the roof covering and a module-side connecting piece disposable on an edge of the photovoltaic module. A flexible retaining element interconnects the roof-side connecting piece and the module-side connecting piece. The flexible retaining element is loadable by pulling and adapted to be guided through the roof covering without altering a position or shape of the individual roof covering elements.
摘要:
A solar installation includes at least one solar module. The at least one solar module includes a cover plate and a housing box. The housing box includes housing walls, a frame construction including a substantially L-shaped support profile, the support profile including a transverse leg disposed edge-parallel on a bottom side of the cover plate with a seal interposed therebetween and a longitudinal leg connected to the housing wall. A detent device has at least one upper detent element and one lower detent element for fixing the cover plate on the housing box. A spring-loaded mounting includes at least two spring elements for mounting the cover plate on the housing walls, via the at least two spring elements. The at least two spring elements have a predetermined vertical stroke and are configured to generate a restoring force.