公开(公告)号：US20120273975A1

公开(公告)日：2012-11-01

申请号：US13520110

申请日：2011-05-31

申请人： Eiji Hayashishita ,  Yoshihisa Saimoto ,  Makoto Kataoka ,  Katsutoshi Ozaki ,  Mitsuru Sakai

发明人： Eiji Hayashishita ,  Yoshihisa Saimoto ,  Makoto Kataoka ,  Katsutoshi Ozaki ,  Mitsuru Sakai

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L21/67132 ,  Y10T428/1471

摘要： To provide a semiconductor wafer surface protection sheet having good adhesion to irregularities on a patterned surface of a semiconductor wafer and having good peelability after wafer grinding. Specifically, a semiconductor wafer surface protection sheet is provided that includes a base layer having a tensile elasticity at 25 C°, E(25), of 1 GPa or more; a resin layer A that satisfies the condition EA(60)/EA(25)

摘要翻译： 提供对半导体晶片的图案化表面上的凹凸具有良好粘附性并且在晶片研磨之后具有良好剥离性的半导体晶片表面保护片。 具体地说，提供一种半导体晶片表面保护片，其包括在25℃，E（25），1GPa以上的拉伸弹性的基底层; 满足条件EA（60）/ EA（25）<0.1的树脂层A，其中EA（25）为2℃时的拉伸弹性，EA（60）为60℃时的拉伸弹性，EA （60）为0.005MPa〜1MPa; 和EB（60）大于EA（60）的EB（60）为1MPa以上，厚度为0.1μm以上且低于100μm的树脂层B， ）树脂层A.

公开(公告)号：US07518965B2

公开(公告)日：2009-04-14

申请号：US11149778

申请日：2005-06-09

申请人： Makoto Kataoka

发明人： Makoto Kataoka

IPC分类号： G11B7/00

CPC分类号： G11B7/139 ,  G11B7/0933 ,  G11B7/0935 ,  G11B7/0956 ,  G11B2007/0006

摘要： An optical pickup device comprising: a tilting mechanism for tilting an objective lens in accordance with tilt of an optical information disc disposed above the objective lens; a wavelength-selecting opening-regulating filter disposed immediately below the objective lens and moving integrally with the objective lens; and a turning mirror for guiding light beams from a light source toward the opening-regulating filter, wherein a stopper for regulating an amount of downward movement of a holder for holding the objective lens and the opening-regulating filter is provided in the vicinity of a plane including the axis of tilting operation of the tilting mechanism and center of the objective lens and at substantially the same height level as that of the opening-regulating filter, and at least one of the opening-regulating filter and the turning mirror has a contact avoiding part for avoiding contact between the opening-regulating filter and the turning mirror.

摘要翻译： 一种光学拾取装置，包括：倾斜机构，用于根据设置在物镜上方的光学信息盘的倾斜来倾斜物镜; 布置在物镜正下方并与物镜一体移动的波长选择开启调节滤光器; 以及用于将来自光源的光束引向开启调节过滤器的转向镜，其中，用于调节用于保持物镜的保持器和开启调节过滤器的向下运动量的止动件设置在 平面，其包括倾斜机构的倾斜操作轴和物镜的中心，并且与开启调节过滤器的高度水平基本相同，并且至少一个开启调节过滤器和转向镜具有接触 避免部件用于避免开启调节过滤器和转向镜之间的接触。

公开(公告)号：US07501312B2

公开(公告)日：2009-03-10

申请号：US11051625

申请日：2005-01-27

申请人： Takanobu Koshimizu ,  Makoto Kataoka ,  Masafumi Miyakawa ,  Hideki Fukumoto ,  Yoshihisa Saimoto

发明人： Takanobu Koshimizu ,  Makoto Kataoka ,  Masafumi Miyakawa ,  Hideki Fukumoto ,  Yoshihisa Saimoto

IPC分类号： H01L21/00 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A protecting method for a semiconductor wafer in a step of processing a semiconductor wafer which involves a first step of adhering an adhesive film for protection of a semiconductor wafer in which an adhesive layer is formed on one surface of a base film to a circuit-formed surface of the semiconductor wafer, a second step of heating the semiconductor wafer to which the adhesive film for protection of the semiconductor wafer is adhered, a third step of processing a non-circuit-formed surface of the semiconductor wafer by fixing the semiconductor wafer to which the adhesive film for protection of the semiconductor wafer is adhered on a grinding machine or an abrasive machine, and a fourth step of peeling the adhesive film for protection of the semiconductor wafer from the semiconductor wafer. The method addresses warpage problems and can prevent breakage of wafers during conveyance even if the thickness of a wafer is reduced to approximately 150 μm or less.

摘要翻译： 一种处理半导体晶片的步骤中的半导体晶片的保护方法，其包括将用于保护形成有粘合剂层的半导体晶片的粘合膜粘附到基膜的一个表面上的第一步骤到电路形成 第二步骤，加热半导体晶片，其上粘附用于保护半导体晶片的粘合膜;第三步骤，通过将半导体晶片固定到半导体晶片的非电路形成表面上 其中用于保护半导体晶片的粘合膜粘附在研磨机或研磨机上，以及第四步骤，从半导体晶片剥离用于保护半导体晶片的粘合剂膜。 该方法解决了翘曲问题，并且即使将晶片的厚度减小到约150μm或更小，也可防止晶片在输送期间的破损。

公开(公告)号：US07370743B2

公开(公告)日：2008-05-13

申请号：US11269191

申请日：2005-11-08

申请人： Makoto Kataoka ,  Satoru Kashiwagi ,  Shunichi Itou

发明人： Makoto Kataoka ,  Satoru Kashiwagi ,  Shunichi Itou

IPC分类号： F16D13/54

CPC分类号： F16D13/58 ,  F16D13/56

摘要： A power transmitting apparatus has a clutch housing (2). A clutch member (4), connected to an output member (3), has a plurality of driven clutch plates (7) alternately arranged between driving clutch plates (6) of the clutch housing (2). A rotational force, inputted to the input member (1), can be transmitted to or cut-off from the output member (3) via pressure-contact or release between the driving clutch plates (6) and driven clutch plates (7). Pressure-contact assist cams and back-torque limiting cams are formed on a pressure plate 5 and the clutch member 4. The gradient angle (α2) of the back-torque limiting cams is formed larger than the gradient angle (α1) of the pressure-contact assisting cams.

摘要翻译： 动力传递装置具有离合器壳体（2）。 与输出构件（3）连接的离合器构件（4）具有交替布置在离合器壳体（2）的驱动离合器片（6）之间的多个从动离合器片（7）。 输入到输入构件（1）的旋转力可以通过驱动离合器片（6）和从动离合器片（7）之间的压力接触或释放从输出构件（3）传递到或切断。 压力接触辅助凸轮和后转矩限制凸轮形成在压力板5和离合器构件4上。 后转矩限制凸轮的倾斜角（α2）形成为大于压接辅助凸轮的倾斜角（α1）。

公开(公告)号：US07237664B2

公开(公告)日：2007-07-03

申请号：US11062945

申请日：2005-02-22

申请人： Norihiro Sugita ,  Makoto Kataoka ,  Tomokatsu Kosuga ,  Ryo Egawa

发明人： Norihiro Sugita ,  Makoto Kataoka ,  Tomokatsu Kosuga ,  Ryo Egawa

IPC分类号： F16D13/68

CPC分类号： F16D13/648

摘要： A power transmitting apparatus, which can simultaneously achieve radial size reduction and improve strength of the driving clutch plate, has a clutch housing (2) and a plurality of driving clutch plates (6) each having projections (6a) projecting radially outward from the periphery of the driving clutch plate (6). The projections (6a) engages the clutch housing (2) to rotate with it. A clutch member (4) has a plurality of driven clutch plates (7) alternately arranged between the driving clutch plates (6). A pressure plate (5) is provided to carry out the pressure-contact or release of the driving clutch plates (6) relative to the driven clutch plates (7). Each of the driving clutch plates (6) has a peripheral surface (β), a projected wall surface (α), of the projections (6a), and a connecting surface (γ). Each connecting surface (γ) connects the projected wall surfaces (α) and the peripheral surface (β). Each of the connecting surfaces (γ) is an arcuate surface smoothly merged into the projected wall surface (α) and forms an undercut, recessed radially inward, from the peripheral surface (β) of the driving clutch plate (6).

摘要翻译： 能够同时实现径向尺寸减小并提高驱动离合器片的强度的动力传递装置具有离合器壳体（2）和多个驱动离合器片（6），每个驱动离合器片（6）具有从 驱动离合器板（6）的周边。 突起（6a）接合离合器壳体（2）以与其一起旋转。 离合器构件（4）具有交替地布置在驱动离合器片（6）之间的多个从动离合器片（7）。 提供压板（5）以相对于从动离合器板（7）执行驱动离合器片（6）的压力接触或释放。 每个驱动离合器片（6）具有凸起（6a）的周边表面（β），突出的壁表面（α）和连接表面（γ）。 每个连接表面（γ）连接投影壁表面（α）和外围表面（β）。 每个连接表面（γ）是平坦地并入到投影壁表面（α）中的弓形表面，并且从驱动离合器片（6）的外周表面（β）形成从径向向内凹陷的底切。

公开(公告)号：US20050244631A1

公开(公告)日：2005-11-03

申请号：US11111721

申请日：2005-04-22

申请人： Kosuke Sugimoto ,  Yoshihisa Saimoto ,  Makoto Kataoka ,  Masafumi Miyakawa ,  Shinichi Hayakawa

发明人： Kosuke Sugimoto ,  Yoshihisa Saimoto ,  Makoto Kataoka ,  Masafumi Miyakawa ,  Shinichi Hayakawa

IPC分类号： H01L21/683 ,  B32B7/12 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68

CPC分类号： H01L21/6836 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809

摘要： The present invention is to provide a surface protecting film for a semiconductor wafer which can prevent breakage of the semiconductor wafer even when the semiconductor wafer is thinned to not more than 200 μm, and a method of protecting the semiconductor wafer using the protecting film. The present invention relates to a surface protecting adhesive film for a semiconductor wafer comprising a base film having an adhesive layer formed on one surface thereof, wherein the base film comprises a layer (A) having a storage elastic modulus of from 1×107 Pa to 1×109 Pa at a temperature range of from 20° C. to 180° C.

摘要翻译： 本发明提供一种用于半导体晶片的表面保护膜，即使半导体晶片减薄到不超过200μm也能够防止半导体晶片的断裂，以及使用保护膜保护半导体晶片的方法。 本发明涉及一种用于半导体晶片的表面保护性粘合膜，其包括在其一个表面上形成有粘合剂层的基膜，其中所述基膜包括具有1×10 7的储能弹性模量的层（A） 在20℃至180℃的温度范围内，Pa至1×10 9 Pa。

公开(公告)号：US06730595B2

公开(公告)日：2004-05-04

申请号：US10003227

申请日：2001-12-06

申请人： Yoshihisa Saimoto ,  Yasuhisa Fujii ,  Makoto Kataoka ,  Kentaro Hirai ,  Hideki Fukumoto ,  Takanobu Koshimizu

发明人： Yoshihisa Saimoto ,  Yasuhisa Fujii ,  Makoto Kataoka ,  Kentaro Hirai ,  Hideki Fukumoto ,  Takanobu Koshimizu

IPC分类号： H01L2144

CPC分类号： H01L21/6835 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/3512

摘要： This invention aims to provide a protecting method for a semiconductor wafer which can prevent breakage of a semiconductor wafer even when a semiconductor wafer is thinned to a thickness of 200 &mgr;m or less, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method. According to this invention, there is provided a protecting method for a semiconductor wafer comprising a first step of adhering a surface protecting adhesive film for a semiconductor wafer to a circuit-formed surface of the semiconductor wafer, a second step of processing a non-circuit-formed surface of the semiconductor wafer and a third step of adhering a bonding film for die bonding to the non-circuit-formed surface of the semiconductor wafer, characterized in that the third step is performed without peeling the surface protecting adhesive film for the semiconductor wafer, and an adhesive film in which an adhesive layer is formed on one surface of a substrate film at least one layer of which is made of a resin having a melting point of 200° C. or more is used, and a surface protecting adhesive film for a semiconductor wafer used in the protecting method.

摘要翻译： 本发明的目的在于提供一种用于半导体晶片的保护方法，即使将半导体晶片减薄至200μm以下的厚度，也可以防止半导体晶片的破损，以及用于保护半导体晶片的表面保护用粘接膜 方法。 根据本发明，提供了一种用于半导体晶片的保护方法，包括将用于半导体晶片的表面保护粘合剂膜粘合到半导体晶片的电路形成表面的第一步骤，第二步骤， 并且将用于管芯接合的接合膜粘合到半导体晶片的非电路形成表面的第三步骤，其特征在于，在不剥离半导体的表面保护粘合剂膜的情况下进行第三步骤 晶片和粘合剂层，其中在基材膜的一个表面上形成粘合剂层，至少一层由熔点为200℃以上的树脂制成，表面保护粘合剂 用于保护方法中使用的半导体晶片的膜。

公开(公告)号：US08627938B2

公开(公告)日：2014-01-14

申请号：US13560923

申请日：2012-07-27

申请人： Makoto Kataoka ,  Naoyuki Miwa ,  Satoru Kashiwagi

发明人： Makoto Kataoka ,  Naoyuki Miwa ,  Satoru Kashiwagi

IPC分类号： F16D13/52 ,  F16D43/21

CPC分类号： F16D13/56 ,  F16D2013/565

摘要： A power transmitting apparatus can include a clutch housing, a plurality of driving and driven clutch plates, a clutch member, a pressure member, an intermediate member, a plurality of urging devices, and a back-torque limiting cam. The power transmitting apparatus can further include an urging force cut-off device for cutting-off the urging force applied to the pressure member from particular urging devices of the plurality of urging devices by separating the inner ends of the particular urging devices from the pressure member when the intermediate member is moved toward the pressure member by the action of the back-torque limiting cam.

摘要翻译： 动力传递装置可包括离合器壳体，多个驱动和从动离合器片，离合器构件，压力构件，中间构件，多个施力装置和后转矩限制凸轮。 动力传递装置还可以包括推力切断装置，用于通过将特定施力装置的内端与压力构件分离来切断由多个施力装置的特定施力装置施加到压力构件的施力 当中间构件通过后转矩限制凸轮的作用朝向压力构件移动时。

公开(公告)号：US08476740B2

公开(公告)日：2013-07-02

申请号：US13520110

申请日：2011-05-31

申请人： Eiji Hayashishita ,  Yoshihisa Saimoto ,  Makoto Kataoka ,  Katsutoshi Ozaki ,  Mitsuru Sakai

发明人： Eiji Hayashishita ,  Yoshihisa Saimoto ,  Makoto Kataoka ,  Katsutoshi Ozaki ,  Mitsuru Sakai

IPC分类号： H01L23/58 ,  H01L21/30 ,  H01L21/46 ,  H01L21/00 ,  B32B9/00 ,  B32B33/00

CPC分类号： H01L21/67132 ,  Y10T428/1471

摘要： To provide a semiconductor wafer surface protection sheet having good adhesion to irregularities on a patterned surface of a semiconductor wafer and having good peelability after wafer grinding. Specifically, a semiconductor wafer surface protection sheet is provided that includes a base layer having a tensile elasticity at 25° C., E(25), of 1 GPa or more; a resin layer A that satisfies the condition EA(60)/EA(25)

摘要翻译： 提供对半导体晶片的图案化表面上的凹凸具有良好粘附性并且在晶片研磨之后具有良好剥离性的半导体晶片表面保护片。 具体地说，提供一种半导体晶片表面保护片，其包括在25℃，E（25），1GPa以上的拉伸弹性的基层; 满足条件EA（60）/ EA（25）<0.1的树脂层A，其中EA（25）为25℃时的拉伸弹性，EA（60）为60℃时的拉伸弹性， EA（60）为0.005MPa〜1MPa; 和EB（60）大于EA（60）的树脂层B，EB（60）为1MPa以上，厚度为0.1μm以上且小于100μm的EB（60） ）树脂层A.

公开(公告)号：US20090309590A1

公开(公告)日：2009-12-17

申请号：US12296770

申请日：2007-03-28

申请人： Makoto Kataoka ,  Katsumi Kakuta ,  Yo Yamagata ,  Yuichi Kanayama

发明人： Makoto Kataoka ,  Katsumi Kakuta ,  Yo Yamagata ,  Yuichi Kanayama

IPC分类号： G01R33/02 ,  H01L21/20

CPC分类号： G01R33/07 ,  G01R33/0011 ,  H01L27/22 ,  H01L43/06

摘要： The present invention relates to a magnetic sensor with which magnetic characteristics are made extremely stable by consideration of an area of contact of a base layer of a magnetic substance and a semiconductor substrate. On a semiconductor substrate a plurality of Hall elements are embedded so as to be coplanar to a top surface of the semiconductor substrate while being mutually spaced apart by a predetermined distance, and above the Hall elements and the semiconductor substrate, a base layer, having a coefficient of thermal expansion differing from that of the Hall elements and partially covers a region of each Hall element, is formed via a protective layer, and a magnetic flux concentrator, having an area larger than the base layer and with magnetic amplification, is formed on the base layer.

摘要翻译： 磁传感器技术领域本发明涉及考虑到磁性物质的基底层与半导体基板的接触面积而使磁特性非常稳定的磁传感器。 在半导体基板上嵌入多个霍尔元件，以便与半导体衬底的顶表面共面一个预定距离相互隔开，并且在霍尔元件和半导体衬底之上，具有基底层 通过保护层形成不同于霍尔元件的热膨胀系数并且部分地覆盖每个霍尔元件的区域，并且具有大于基底层和磁放大的面积的磁通集中器形成在 基层。