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1.发明申请公开(公告)号：US20090317036A1
公开(公告)日：2009-12-24
申请号：US12373234
申请日：2007-07-12
IPC分类号： G02B6/42
CPC分类号： G02B6/4232 , G02B6/4204
摘要： Mounting an electro-optical component (1) on a carrier substrate (2) in an accurate position with respect to an optical element (6), the carrier substrate and the electro-optical component each being provided with at least one solder pad (3, 4). The solder pads are arranged such that, when said electro-optical component is soldered onto the pads, a force is generated that acts on the electro-optical component in a direction (x) towards the optical element, and the structure is designed to allow said electro-optical component to move laterally during soldering, such that it is brought into abutment with said optical element, thereby ensuring an accurate relative positioning between the electro-optical component and the optical element.
摘要翻译： 将相对于光学元件（6）的精确位置的电光学部件（1）安装在载体基板（2）上，载体基板和电光部件各自设置有至少一个焊盘（3） ，4）。 焊盘被布置成使得当所述电光部件焊接到焊盘上时，产生朝向光学元件的方向（x）作用在电光部件上的力，并且该结构被设计成允许 所述电光部件在焊接期间横向移动，使得其与所述光学元件邻接，从而确保电光部件和光学元件之间的精确的相对定位。
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公开(公告)号：US20090279575A1
公开(公告)日：2009-11-12
申请号：US12097610
申请日：2006-12-13
申请人： Eric C.E. van Grunsven , Willem Hoving , Anton P.M. van Arendonk , Johannes W. Weekamp , Olaf T.J. Vermeulen , Marc A. de Samber
发明人： Eric C.E. van Grunsven , Willem Hoving , Anton P.M. van Arendonk , Johannes W. Weekamp , Olaf T.J. Vermeulen , Marc A. de Samber
CPC分类号： H01S5/423 , G02F1/37 , H01S5/0092 , H01S5/02248 , H01S5/02272 , H01S5/141 , H01S5/183
摘要： A carrier substrate (100) with laser sources includes a transparent center substrate (20), an upper substrate (30) adhered to the center substrate having openings (40) formed therein to expose the center substrate on a first side, and a lower substrate (32) adhered to the center substrate on a second side opposite the first side and having openings (42) formed therein to expose the center substrate on the second side, the openings on the lower substrate corresponding to positions of the openings in the upper substrate. Frequency conversion elements (60) are disposed on the center substrate within the openings of the lower substrate. Laser dies (70) are aligned to the frequency conversion elements and coupled to the lower substrate to provide light though the frequency conversion elements and the center substrate during operation. Methods for fabrication are also disclosed.
摘要翻译： 具有激光源的载体衬底（100）包括透明中心衬底（20），粘附到具有形成在其中的开口（40）的中心衬底的上衬底（30），以在第一侧上露出中心衬底;以及下衬底 （32）在与所述第一侧相对的第二侧上粘附到所述中心基板并且具有形成在其中的开口（42）以暴露所述第二侧上的所述中心基板，所述下基板上的开口对应于所述上基板中的开口的位置 。 变频元件（60）设置在下基板的开口内的中心基板上。 激光管芯（70）与频率转换元件对准并且耦合到下基板，以在操作期间通过变频元件和中心基板提供光。 还公开了制造方法。
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3.发明授权Methods for mounting an electro-optical component in alignment with an optical element and related structures 有权用于安装与光学元件对准的电光部件和相关结构的方法公开(公告)号：US08086082B2
公开(公告)日：2011-12-27
申请号：US12373234
申请日：2007-07-12
IPC分类号： G02B6/26
CPC分类号： G02B6/4232 , G02B6/4204
摘要： Mounting an electro-optical component (1) on a carrier substrate (2) in an accurate position with respect to an optical element (6), the carrier substrate and the electro-optical component each being provided with at least one solder pad (3, 4). The solder pads are arranged such that, when said electro-optical component is soldered onto the pads, a force is generated that acts on the electro-optical component in a direction (x) towards the optical element, and the structure is designed to allow said electro-optical component to move laterally during soldering, such that it is brought into abutment with said optical element, thereby ensuring an accurate relative positioning between the electro-optical component and the optical element.
摘要翻译： 将相对于光学元件（6）的精确位置的电光学部件（1）安装在载体基板（2）上，载体基板和电光部件各自设置有至少一个焊盘（3） ，4）。 焊盘被布置成使得当所述电光部件焊接到焊盘上时，产生朝向光学元件的方向（x）作用在电光部件上的力，并且该结构被设计成允许 所述电光部件在焊接期间横向移动，使得其与所述光学元件邻接，从而确保电光部件和光学元件之间的精确的相对定位。
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