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公开(公告)号：US07160413B2
公开(公告)日：2007-01-09
申请号：US10754381
申请日：2004-01-09
IPC分类号： B24D11/00
CPC分类号： B24B37/22 , B24D18/00 , B32B37/0007 , B32B37/12 , B32B37/26
摘要： A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.
摘要翻译： 用于层压CMP垫的装置和方法包括用具有类似于CMP垫的材料组成的板支撑CMP垫。 通过在层压期间支撑CMP焊盘，不太可能损坏CMP焊盘并且具有更好的层压附着力。 特别地，CMP垫材料与第一板接触，该第一板可以具有凹部以接受CMP垫。 垫具有等于或大于垫材料的尺寸。 在替代实施例中，在CMP垫的相对侧上设置有用于层压的板。
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公开(公告)号：US20050150594A1
公开(公告)日：2005-07-14
申请号：US10754381
申请日：2004-01-09
CPC分类号： B24B37/22 , B24D18/00 , B32B37/0007 , B32B37/12 , B32B37/26
摘要： A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.
摘要翻译： 用于层压CMP垫的装置和方法包括用具有类似于CMP垫的材料组成的板支撑CMP垫。 通过在层压期间支撑CMP焊盘，不太可能损坏CMP焊盘并且具有更好的层压附着力。 特别地，CMP垫材料与第一板接触，该第一板可以具有凹部以接受CMP垫。 垫具有等于或大于垫材料的尺寸。 在替代实施例中，在CMP垫的相对侧上设置有用于层压的板。
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