公开(公告)号：US10234513B2

公开(公告)日：2019-03-19

申请号：US13424618

申请日：2012-03-20

申请人： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric Shoemaker ,  Michael C. Doogue

发明人： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric Shoemaker ,  Michael C. Doogue

IPC分类号： G01R33/02 ,  G01B7/30 ,  G01R33/00

摘要： A magnetic field sensor includes a lead frame, a semiconductor die supporting a magnetic field sensing element, a non-conductive mold material enclosing the die and a portion of the lead frame, a ferromagnetic mold material secured to the non-conductive mold material and a securing mechanism to securely engage the mold materials. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet. The ferromagnetic mold material may be tapered and includes a non-contiguous central region, as may be an aperture or may contain the non-conductive mold material or an overmold material. Further embodiments include die up, lead on chip, and flip-chip arrangements, wafer level techniques to form the concentrator or bias magnet, integrated components, such as capacitors, on the lead frame, and a bias magnet with one or more channels to facilitate overmolding.

公开(公告)号：US20130249544A1

公开(公告)日：2013-09-26

申请号：US13424618

申请日：2012-03-20

申请人： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric Shoemaker ,  Michael C. Doogue

发明人： Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich ,  Paul David ,  Marie-Adelaide Lo ,  Eric Burdette ,  Eric Shoemaker ,  Michael C. Doogue

IPC分类号： G01R33/02

CPC分类号： G01R33/0047 ,  G01B7/30 ,  G01R33/0011

摘要： A magnetic field sensor includes a lead frame, a semiconductor die supporting a magnetic field sensing element, a non-conductive mold material enclosing the die and a portion of the lead frame, a ferromagnetic mold material secured to the non-conductive mold material and a securing mechanism to securely engage the mold materials. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet. The ferromagnetic mold material may be tapered and includes a non-contiguous central region, as may be an aperture or may contain the non-conductive mold material or an overmold material. Further embodiments include die up, lead on chip, and flip-chip arrangements, wafer level techniques to form the concentrator or bias magnet, integrated components, such as capacitors, on the lead frame, and a bias magnet with one or more channels to facilitate overmolding.

摘要翻译： 磁场传感器包括引线框架，支撑磁场感测元件的半导体管芯，封装模具的非导电模具材料和引线框架的一部分，固定到非导电模具材料的铁磁模具材料和 固定机构可牢固地接合模具材料。 铁磁模具材料可以包括软铁磁材料以形成集中器或硬铁磁材料以形成偏置磁体。 铁磁模具材料可以是锥形的并且包括不连续的中心区域，可以是孔或可以包含非导电模具材料或包覆模制材料。 另外的实施例包括裸片，片上芯片和倒装芯片布置，用于形成集中器或偏置磁体的晶片级技术，引线框架上的诸如电容器之类的集成部件，以及具有一个或多个通道的偏置磁体，以便于 包覆成型