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公开(公告)号:US07952160B2
公开(公告)日:2011-05-31
申请号:US11968115
申请日:2007-12-31
申请人: Nicholas D. Triantafillou , Malay Trivedi , Erik A. McShane , James T. Doyle , Mark J. Kachmarek
发明人: Nicholas D. Triantafillou , Malay Trivedi , Erik A. McShane , James T. Doyle , Mark J. Kachmarek
IPC分类号: H01L21/70
CPC分类号: H01L23/645 , H01F2017/0086 , H01L2224/16227 , H01L2224/16265 , H01L2924/0002 , H01L2924/19103 , H01L2924/19104 , H01L2924/3011 , H01L2924/00
摘要: Inductors packaged with a voltage regulator for an integrated circuit within the same package are deposited to a sufficient thickness to reduce resistance and improve the quality factor. Furthermore, the voltage regulator switches currents through the inductors at a relatively high frequency such that the overall size and inductances of the inductors may be reduced. As a consequence, integrating both the integrated circuits including a voltage regulator and associated inductor array in a single package is facilitated. Other embodiments are described and claimed.
摘要翻译: 与同一封装内的集成电路的电压调节器封装的电感器被沉积到足够的厚度以降低电阻并提高品质因数。 此外,电压调节器以相对高的频率切换电流通过电感器,使得可以减小电感器的总体尺寸和电感。 因此,将包括电压调节器和相关联的电感器阵列的集成电路集成在单个封装中是便利的。 描述和要求保护其他实施例。
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公开(公告)号:US20100033236A1
公开(公告)日:2010-02-11
申请号:US11968115
申请日:2007-12-31
申请人: Nicholas D. TRIANTAFILLOU , Malay TRIVEDI , Erik A. MCSHANE , James T. DOYLE , Mark J. KACHMAREK
发明人: Nicholas D. TRIANTAFILLOU , Malay TRIVEDI , Erik A. MCSHANE , James T. DOYLE , Mark J. KACHMAREK
CPC分类号: H01L23/645 , H01F2017/0086 , H01L2224/16227 , H01L2224/16265 , H01L2924/0002 , H01L2924/19103 , H01L2924/19104 , H01L2924/3011 , H01L2924/00
摘要: Inductors packaged with a voltage regulator for an integrated circuit within the same package are deposited to a sufficient thickness to reduce resistance and improve the quality factor. Furthermore, the voltage regulator switches currents through the inductors at a relatively high frequency such that the overall size and inductances of the inductors may be reduced. As a consequence, integrating both the integrated circuits including a voltage regulator and associated inductor array in a single package is facilitated. Other embodiments are described and claimed.
摘要翻译: 与同一封装内的集成电路的电压调节器封装的电感器被沉积到足够的厚度以降低电阻并提高品质因数。 此外,电压调节器以相对高的频率切换电流通过电感器,使得可以减小电感器的总体尺寸和电感。 因此,将包括电压调节器和相关联的电感器阵列的集成电路集成在单个封装中是便利的。 描述和要求保护其他实施例。
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