公开(公告)号：US5455738A

公开(公告)日：1995-10-03

申请号：US97903

申请日：1993-07-28

申请人： Mark J. Montesano ,  John T. Wigand ,  Joseph C. Roesch

发明人： Mark J. Montesano ,  John T. Wigand ,  Joseph C. Roesch

IPC分类号： C22C26/00 ,  H01L23/373 ,  H05K7/20

CPC分类号： H01L23/3733 ,  C22C26/00 ,  H01L23/3732 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/12146

摘要： A circuit card assembly thermal core includes a composite material that includes particles of diamond and a conductive metal such as aluminum, copper, nickel and beryllium and which may be made by pressure infiltration casting. The diamond particles are 110 to 160 microns in size and 10 to 80 percent by volume, and preferably 140 to 160 microns in size and 40 to 60 percent by volume. The composite material has both a high thermal conductivity and low density which may be matched with the coefficient of thermal expansion of other materials with which used.

摘要翻译： 电路卡组件热芯包括复合材料，其包括金刚石颗粒和导电金属如铝，铜，镍和铍，并且可以通过压力渗透铸造制成。 金刚石颗粒的尺寸为110至160微米，体积为10至80体积％，优选为140至160微米，且体积为40至60体积％。 复合材料具有高导热性和低密度，其可与其他所用材料的热膨胀系数相匹配。

公开(公告)号：US5434358A

公开(公告)日：1995-07-18

申请号：US166299

申请日：1993-12-13

申请人： Timothy J. Glahn ,  Mark J. Montesano

发明人： Timothy J. Glahn ,  Mark J. Montesano

IPC分类号： H01L23/10 ,  H01L23/02

CPC分类号： H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701

摘要： A ceramic feedthrough for a package for an electronic device provides a plurality of electrical connections through an opening in the package. A method of making the feedthrough and of packaging the electronic device includes electrically conductive paths that are formed from a metal paste applied between green sheets that are joined and cofired to form a ceramic body. Vias extend from an exterior surface of the ceramic body to the paths to complete the electrical connection from outside the package to inside the package. A density of 50 paths per inch or greater may be achieved. The ceramic body may be hermetically sealed into an opening in the package and the body may have a peripheral extension to facilitate attachment of the feedthrough to the package.

摘要翻译： 用于电子设备的封装的陶瓷馈通通过封装中的开口提供多个电连接。 制造馈通和包装电子器件的方法包括由施加在接合并共烧以形成陶瓷体的生片之间的金属糊形成的导电路径。 通孔从陶瓷体的外表面延伸到路径，以完成从包装外部到包装内部的电连接。 可以实现每英寸或更大的50路径的密度。 陶瓷体可以气密地密封在包装中的开口中，并且主体可以具有外围延伸部以便于馈送连接到包装上。

公开(公告)号：US5111359A

公开(公告)日：1992-05-05

申请号：US686604

申请日：1991-04-17

申请人： Mark J. Montesano

发明人： Mark J. Montesano

IPC分类号： F28F21/00 ,  H05K7/20

CPC分类号： H05K7/20545 ,  F28F21/00 ,  Y10S428/901

摘要： A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improved thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the core of the board may be parallel to the mounting surface of the core throughout their length. The device may include at least two thermally conductive wedges embedded in the core for conducting heat into and out of the interior of the core. The wedges may be milled metal that may be mechanically and/or thermally attached to the composite material. The wedges may also be chemically plated to the composite. A plurality of the fibers contact both wedges to conduct heat to a surface adapted to transfer heat to the sink. A method of manufacture of the device provides that cavities for the wedges may be milled in the composite material of the core.

摘要翻译： 传热装置和方法可以用于将热量从热源传导到散热器。 该装置和方法改善了用于发热部件的复合材料安装板中的热传导。 板芯的复合材料纤维可以在整个长度上平行于芯的安装表面。 该装置可以包括至少两个嵌入在芯中的导热楔，用于将热量导入和移出芯的内部。 楔形物可以是可以机械地和/或热连接到复合材料上的碾磨的金属。 楔子也可以化学镀在复合材料上。 多个纤维接触两个楔形件以将热量传导到适于将热量传递到水槽的表面。 该装置的制造方法提供了用于楔形的空腔可以在芯的复合材料中研磨。

公开(公告)号：US5459923A

公开(公告)日：1995-10-24

申请号：US98057

申请日：1993-07-28

申请人： Mark J. Montesano

发明人： Mark J. Montesano

IPC分类号： H01L21/48 ,  H01L23/055 ,  H01L23/498 ,  H05K1/03 ,  H05K3/40 ,  H01R43/16

CPC分类号： H01L23/055 ,  H01L21/486 ,  H01L23/49827 ,  H05K3/4061 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2203/128 ,  Y10T29/49124 ,  Y10T29/49204

摘要： A device and method of manufacture for producing electrically conductive regions in hermetically sealed insulative plates or hermetically sealed electronic component enclosures. The electrically conductive regions consist of a monolithic composite material comprising particles of an insulative material and a conductive metal. The material of the insulative particles, their size, and the type of conductive metal used are selected so that the coefficient of thermal expansion (CTE) of the resulting electrically conductive region approximates the CTE of the surrounding material.

摘要翻译： 一种用于在气密密封绝缘板或密封电子部件外壳中制造导电区域的装置和方法。 导电区域由包括绝缘材料和导电金属颗粒的整体复合材料组成。 选择绝缘颗粒的材料，其尺寸和导电金属的类型，使得所得导电区域的热膨胀系数（CTE）接近周围材料的CTE。

公开(公告)号：US5287248A

公开(公告)日：1994-02-15

申请号：US877203

申请日：1992-05-01

申请人： Mark J. Montesano

发明人： Mark J. Montesano

IPC分类号： F28F21/00 ,  H05K7/20

CPC分类号： H05K7/20545 ,  F28F21/00 ,  Y10S428/901

摘要： A heat transfer device and method may be used to conduct heat from a heat source to a heat sink. The device and method improve thermal conduction in composite material mounting boards for heat generating components. The composite material fibers in the board may be parallel to the mounting surface of the board throughout their length. The matrix material for the composite material may be a metal, such as aluminum, that has some capacity to conduct heat. The device may include at least two thermally conductive wedges in the board for conducting heat into and out of the interior of the board. The wedges and the metal matrix may be the same conductive metal. A plurality of the fibers and the metal matrix contact both wedges to conduct heat to a surface adapted to transfer heat to the sink. A method of manufacture of the device provides that the wedges may be formed by placing the fibers in layers having decreasing lengths and adding the metal matrix material.

摘要翻译： 传热装置和方法可以用于将热量从热源传导到散热器。 该装置和方法提高了用于发热部件的复合材料安装板中的热传导。 板中的复合材料纤维可以在整个长度上平行于板的安装表面。 用于复合材料的基质材料可以是具有一定导热能力的金属，例如铝。 该装置可以在板中包括至少两个导热楔，用于将热量导入和移出板的内部。 楔子和金属基体可以是相同的导电金属。 多个纤维和金属基体接触两个楔形物以将热量传导到适于将热量传递到水槽的表面。 该装置的制造方法提供了可以通过将纤维放置在具有较小长度的层中并加入金属基质材料来形成楔形物。